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FP25R12W2T4

Infineon Technologies

FP25R12W2T4 by Infineon Technologies

FP25R12W2T4 by Infineon Technologies is an N-CHANNEL IGBT transistor with 1200V VCE, 39A IC, and 175W power dissipation. It is used for POWER CONTROL applications due to its 685ns turn-off time and complex configuration. The transistor's silicon material and isolated case connection make it suitable for high-power operations at up to 175°C.

Median Price

$63.385

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 44 parts In-Stock

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$44.900

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-

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$34.820

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44

$44.900

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$34.820

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Element14

Singapore . 12 parts In-Stock

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$81.870

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$66.980

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12

$81.870

$66.980

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Distributors (In-Stock)

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Maritex

Poland . 560 parts In-Stock

1+ parts

$33.915

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$30.526

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560

$33.915

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$30.526

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Digiode

USA . 954 parts In-Stock

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$43.500

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954

$43.500

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$98.000

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1

$98.000

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Sensible Micro Corp

USA . 1,598 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

USA . 36 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 6,413 parts In-Stock

1+ parts

$1.922

100+ parts

$1.845

1k+ parts

$1.768

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-

6,413

$1.922

$1.845

$1.768

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AZTECH Wire

Italy . 761 parts In-Stock

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$13.627

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Corphita

USA . 193 parts In-Stock

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$41.211

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Continental Prestige Electronics

USA . 6 parts In-Stock

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$41.450

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6

$41.450

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Ampacity Inc.

Singapore . 20 parts In-Stock

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$43.480

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Lixinc

USA . 16,932 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,460 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,373 parts In-Stock

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Argo Parts USA

USA . 715 parts In-Stock

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Kepictronics

USA . 550 parts In-Stock

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550

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Futuretech Components

Singapore . 300 parts In-Stock

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Overview

Unlock the power of precision and efficiency with the FP25R12W2T4 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that are designed for optimal performance in power control applications. With a maximum VCEsat of 2.25V and a maximum collector-emitter voltage of 1200V, this transistor offers unmatched reliability and durability. Whether you're looking to enhance your power conversion systems or improve motor control applications, the FP25R12W2T4 provides superior value, benefits, and advantages to meet all your needs. Experience the difference with Infineon Technologies today.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - N-channel IGBTs are generally better suited for high-power applications as they have higher electron mobility compared to P-channel IGBTs.

Configuration

COMPLEX - Complex configuration offers more flexibility in terms of power control and efficiency.

Transistor Application

POWER CONTROL - Specifically designed for power control applications, ensuring optimal performance and reliability.

Maximum VCEsat

2.25 V - Lower VCEsat value indicates lower power losses and improved efficiency in power switching applications.

Package Shape

RECTANGULAR - Rectangular package shape allows for easier mounting and installation in various systems.

No. of Elements

7 - Higher number of elements can provide greater power handling capabilities and more precise control.

Nominal Turn Off Time (toff)

685 ns - Faster turn-off time results in reduced switching losses and improved overall efficiency.

No. of Terminals

35 - More terminals provide increased connectivity options and better control over the circuit.

Maximum Power Dissipation (Abs)

175 W - High power dissipation allows for handling large amounts of power, making it suitable for high-power applications.

Package Style (Meter)

FLANGE MOUNT - Flange mount package style offers easy and secure mounting in various systems.

Maximum Operating Temperature

175 °C - High maximum operating temperature ensures the device can withstand harsh operating conditions.

Maximum Collector-Emitter Voltage

1200 V - High collector-emitter voltage rating allows for handling high voltages in power control applications.

Transistor Element Material

SILICON - Silicon material provides high performance and reliability in power control applications.

Maximum Gate-Emitter Voltage

20 V - High gate-emitter voltage rating ensures stable and reliable operation of the device.

Maximum Collector Current (IC)

39 A - High collector current rating enables the device to handle high current loads in power control applications.

Terminal Position

UPPER - Upper terminal position allows for easier connectivity and integration in circuit designs.

Case Connection

ISOLATED - Isolated case connection helps in preventing electrical interference and ensures safety in operation.

Nominal Turn On Time (ton)

133 ns - Faster turn-on time results in quicker response and better control in power switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP25R12W2T4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

685 ns

Nominal Turn On Time (ton):

133 ns

Maximum VCEsat:

2.25 V

Trade Compliance

FP25R12W2T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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