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FP25R12W2T4B11BOMA1

Infineon Technologies

FP25R12W2T4B11BOMA1 by Infineon Technologies

FP25R12W2T4B11BOMA1 by Infineon Technologies is an N-CHANNEL IGBT with 1200V max collector-emitter voltage and 39A max collector current. It has a complex configuration, 7 elements, and is used for power control applications. With a nominal turn-off time of 520ns and turn-on time of 47ns, it features a rectangular package style with flange mount.

Median Price

$43.187

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 28 parts In-Stock

1+ parts

$36.640

100+ parts

$32.200

1k+ parts

$31.370

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28

$36.640

$32.200

$31.370

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Chip1Stop

Japan . 13 parts In-Stock

1+ parts

$40.400

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$40.400

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Arrow

USA . 7 parts In-Stock

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$43.144

100+ parts

$37.863

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7

$43.144

$37.863

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DigiKey

USA . 51 parts In-Stock

1+ parts

$43.230

100+ parts

$31.063

1k+ parts

$29.795

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51

$43.230

$31.063

$29.795

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Farnell

UK . 42 parts In-Stock

1+ parts

$47.020

100+ parts

$38.480

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-

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42

$47.020

$38.480

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RS (Exports)

UK . 9 parts In-Stock

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$72.134

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9

$72.134

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Element14

Singapore . 42 parts In-Stock

1+ parts

$84.080

100+ parts

$68.380

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42

$84.080

$68.380

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Rochester

USA . 20 parts In-Stock

1+ parts

-

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$29.790

1k+ parts

$26.660

10k+ parts

$25.090

20

-

$29.790

$26.660

$25.090

Verical

USA . 8 parts In-Stock

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8

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Distributors (In-Stock)

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Digiode

USA . 943 parts In-Stock

1+ parts

$32.642

100+ parts

-

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943

$32.642

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Galco

USA . 1 parts In-Stock

1+ parts

$52.140

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-

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1

$52.140

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Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$58.394

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34

$58.394

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Vyrian

USA . 3,888 parts In-Stock

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3,888

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Rutronik

Germany . 15 parts In-Stock

1+ parts

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$36.510

1k+ parts

$34.340

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15

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$36.510

$34.340

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,306 parts In-Stock

1+ parts

$1.380

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4,306

$1.380

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Corohmni

South Africa . 38 parts In-Stock

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$1.512

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38

$1.512

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Modulus Dynamics

Lithuania . 3,953 parts In-Stock

1+ parts

$1.605

100+ parts

$1.541

1k+ parts

$1.477

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-

3,953

$1.605

$1.541

$1.477

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AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$15.731

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525

$15.731

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Ampacity Inc.

Singapore . 22 parts In-Stock

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$29.210

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22

$29.210

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Corphita

USA . 905 parts In-Stock

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$30.924

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905

$30.924

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Continental Prestige Electronics

USA . 39 parts In-Stock

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$48.590

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39

$48.590

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$57.345

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$57.345

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$57.345

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2,000

$57.345

$57.345

$57.345

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Microchip USA

USA . 2,280 parts In-Stock

1+ parts

$145.636

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2,280

$145.636

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,351 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Unleash the power of the FP25R12W2T4B11BOMA1 by Infineon Technologies, a top-tier manufacturer known for delivering superior quality in the Insulated Gate Bipolar Transistor (IGBT) category. This N-CHANNEL transistor in a COMPLEX configuration is perfect for POWER CONTROL applications. With a maximum Collector-Emitter Voltage of 1200V and a Nominal Turn On Time of just 47 ns, this product offers unrivaled performance and efficiency. Trust Infineon Technologies to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state resistance and higher switching speeds, making them suitable for power control applications.

Configuration: COMPLEX

Complex configuration allows for versatile and customized circuit designs, offering more control and efficiency in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency in managing power flow.

Package Shape: RECTANGULAR

Rectangular package shape offers compact and efficient design, ideal for space-constrained applications while providing easy mounting and heat dissipation.

No. of Elements: 7

Multiple elements enable higher power handling capacity and better distribution of current, enhancing overall performance in power control applications.

Nominal Turn Off Time (toff): 520 ns

Fast turn-off time ensures efficient switching and minimizes power loss, contributing to higher efficiency and reliability in power control operations.

No. of Terminals: 23

Higher number of terminals offer more connectivity options and flexibility in circuit design, allowing for advanced control and monitoring capabilities.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and thermal management, ensuring reliable performance and durability in harsh operating conditions.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for handling of higher voltage levels, extending the range of applications and enhancing safety and reliability.

Transistor Element Material: SILICON

Silicon material offers high reliability and temperature resistance, ensuring stable performance and longevity in demanding power control applications.

Maximum Collector Current (IC): 39 A

High collector current rating enables handling of larger currents, providing increased power capacity and performance in power control operations.

Terminal Position: UPPER

Upper terminal position facilitates easier connections and better heat dissipation, enhancing overall performance and reliability of the device.

Case Connection: ISOLATED

Isolated case connection ensures safety and protection against electrical hazards, making it a reliable choice for high-voltage power control applications.

Nominal Turn On Time (ton): 47 ns

Fast turn-on time allows for quick response and precise control in power switching operations, enhancing efficiency and accuracy in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP25R12W2T4B11BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

520 ns

Nominal Turn On Time (ton):

47 ns

Trade Compliance

FP25R12W2T4B11BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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