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FP25R12W2T4BOMA1

Infineon Technologies

FP25R12W2T4BOMA1 by Infineon Technologies

FP25R12W2T4BOMA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements, max. voltage of 1200V, and max. current of 39A. Ideal for power control applications, it has a turn off time of 685ns and turn on time of 133ns. The package style is flange mount with a rectangular shape and isolated case connection.

Median Price

$41.190

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$24.390

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2

$24.390

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Verical

USA . 2 parts In-Stock

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$24.390

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2

$24.390

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$41.100

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30

$41.100

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Newark

USA . 18 parts In-Stock

1+ parts

$41.280

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18

$41.280

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Farnell

UK . 52 parts In-Stock

1+ parts

$46.720

100+ parts

$35.820

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52

$46.720

$35.820

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Element14

Singapore . 19 parts In-Stock

1+ parts

$64.920

100+ parts

$47.030

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19

$64.920

$47.030

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RS (Exports)

UK . 11 parts In-Stock

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$68.644

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$68.644

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Rochester

USA . 15 parts In-Stock

1+ parts

-

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$29.790

1k+ parts

$26.660

10k+ parts

$25.090

15

-

$29.790

$26.660

$25.090

DigiKey

USA . 15 parts In-Stock

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Digiode

USA . 189 parts In-Stock

1+ parts

$35.720

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189

$35.720

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$47.740

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750

$47.740

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Schukat

Germany . 1 parts In-Stock

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$48.880

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$34.221

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1

$48.880

$34.221

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TodayComponents

USA . 100 parts In-Stock

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$61.650

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$55.730

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$61.650

$55.730

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Vyrian

USA . 8,095 parts In-Stock

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Chip Stock

USA . 480 parts In-Stock

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DigiKey Marketplace

USA . 30 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,890 parts In-Stock

1+ parts

$0.690

100+ parts

$0.662

1k+ parts

$0.635

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2,890

$0.690

$0.662

$0.635

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Corohmni

South Africa . 179 parts In-Stock

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$1.422

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$1.422

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AZTECH Wire

Italy . 266 parts In-Stock

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$14.137

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$14.137

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Ampacity Inc.

Singapore . 27 parts In-Stock

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$15.750

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$15.750

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Continental Prestige Electronics

USA . 19 parts In-Stock

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$31.580

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$31.580

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Corphita

USA . 315 parts In-Stock

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$33.840

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$33.840

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Microchip USA

USA . 5,755 parts In-Stock

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$141.312

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5,755

$141.312

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GreenTree Electronics

Israel . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,380 parts In-Stock

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Argo Parts USA

USA . 4,965 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,920 parts In-Stock

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4,920

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Netroflash

USA . 100 parts In-Stock

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$46.785

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$45.353

10k+ parts

$44.398

100

-

$46.785

$45.353

$44.398

Overview

Transform the way you power control applications with the FP25R12W2T4BOMA1 by Infineon Technologies. As a leader in insulated gate bipolar transistors, Infineon delivers exceptional quality and reliability for your complex power control needs. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of 685ns, this N-channel transistor offers superior performance in various applications. Trust in Infineon's expertise to provide you with the value and benefits you need to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT ensures reliable and efficient performance in managing power.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage, this IGBT can withstand high voltage levels, making it suitable for high-power applications.

Maximum Collector Current (IC): 39 A

Capable of handling a maximum collector current of 39 A, this IGBT is suitable for applications requiring high power handling capabilities.

Nominal Turn On Time (ton): 133 ns

The fast turn on time of 133 ns ensures quick response and efficient power control, making it suitable for applications requiring fast switching speeds.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP25R12W2T4BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

685 ns

Nominal Turn On Time (ton):

133 ns

Trade Compliance

FP25R12W2T4BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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