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FP25R12W2T4P_B11ENG

Infineon Technologies

FP25R12W2T4P_B11ENG by Infineon Technologies

Infineon's FP25R12W2T4P_B11ENG IGBT features 1200V VCEsat, 520ns toff, and 47ns ton. Ideal for high-power applications in industries like automotive, renewable energy, and industrial automation due to its N-Channel polarity and -40°C to 150°C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,273 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Digiode

USA . 367 parts In-Stock

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Modulus Dynamics

Lithuania . 4,380 parts In-Stock

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$1.905

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$1.829

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$1.753

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AZTECH Wire

Italy . 396 parts In-Stock

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$14.121

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Ampacity Inc.

Singapore . 401 parts In-Stock

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$57.050

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Continental Prestige Electronics

USA . 5,458 parts In-Stock

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Argo Parts USA

USA . 2,043 parts In-Stock

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Corphita

USA . 727 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the FP25R12W2T4P_B11ENG by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that are designed to optimize performance and efficiency. Whether you're looking to enhance power conversion systems or improve motor control applications, this N-Channel IGBT offers unmatched reliability and durability. Experience the value of seamless operation, enhanced thermal management, and increased energy savings with the FP25R12W2T4P_B11ENG. Elevate your projects to new heights with this innovative solution from Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-Channel

N-Channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for applications where power management is crucial.

Maximum VCEsat: 2.25 V

The low VCEsat value indicates minimal energy loss in the switching process, leading to higher efficiency and reduced heat generation in the IGBT.

Nominal Turn Off Time (toff): 520 ns

The fast turn-off time allows for quick switching and improves the overall performance of the IGBT in high-frequency applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable operation even in demanding environments where temperature fluctuations are common.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating makes this IGBT suitable for high-power applications that require voltage handling capabilities.

Transistor Element Material: SILICON

Silicon-based IGBTs are known for their high performance, reliability, and durability, making them a preferred choice for various industrial applications.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating ensures proper gate control and allows for efficient switching of the IGBT in various operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IGBT can function effectively in cold environments without compromising its performance.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

The gate-emitter threshold voltage determines the turn-on characteristics of the IGBT and ensures precise control over the switching behavior of the device.

Case Connection: ISOLATED

The isolated case connection helps in preventing electrical interference and enhances the safety and reliability of the IGBT in various applications.

Nominal Turn On Time (ton): 47 ns

The fast turn-on time allows for quick response and efficient switching of the IGBT, making it suitable for high-speed applications that require rapid switching capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP25R12W2T4P_B11ENG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Polarity or Channel Type:

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

520 ns

Nominal Turn On Time (ton):

47 ns

Maximum VCEsat:

2.25 V

Trade Compliance

FP25R12W2T4P_B11ENG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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