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AFGHL50T65SQD

Onsemi

AFGHL50T65SQD by Onsemi

AFGHL50T65SQD by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and a max collector current (IC) of 80A. It is commonly used for power control applications due to its high power dissipation of 268W and max operating temperature of 175°C.

Median Price

$6.180

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,330 parts In-Stock

1+ parts

$4.910

100+ parts

$2.470

1k+ parts

$1.930

10k+ parts

-

1,330

$4.910

$2.470

$1.930

-

Mouser Electronics

USA . 696 parts In-Stock

1+ parts

$5.850

100+ parts

-

1k+ parts

$2.730

10k+ parts

$2.600

696

$5.850

-

$2.730

$2.600

DigiKey

USA . 215 parts In-Stock

1+ parts

$6.510

100+ parts

$3.714

1k+ parts

$2.650

10k+ parts

$2.604

215

$6.510

$3.714

$2.650

$2.604

Newark

USA . 1,330 parts In-Stock

1+ parts

$7.040

100+ parts

$4.370

1k+ parts

$4.190

10k+ parts

-

1,330

$7.040

$4.370

$4.190

-

Element14

Singapore . 1,330 parts In-Stock

1+ parts

$8.810

100+ parts

$4.240

1k+ parts

-

10k+ parts

-

1,330

$8.810

$4.240

-

-

Chip1Stop

Japan . 4,800 parts In-Stock

1+ parts

$16.700

100+ parts

$7.510

1k+ parts

$4.830

10k+ parts

-

4,800

$16.700

$7.510

$4.830

-

Verical

USA . 115,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.621

10k+ parts

-

115,650

-

-

$2.621

-

Flip Electronics (Authorized)

USA . 54,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54,900

-

-

-

-

Rochester

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$2.600

1k+ parts

$2.330

10k+ parts

$2.190

420

-

$2.600

$2.330

$2.190

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 242 parts In-Stock

1+ parts

$2.404

100+ parts

-

1k+ parts

-

10k+ parts

-

242

$2.404

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.376

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$3.376

-

-

-

Flip Electronics

USA . 171,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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171,000

-

-

-

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Vyrian

USA . 8,074 parts In-Stock

1+ parts

-

100+ parts

-

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8,074

-

-

-

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VNN

France . 5,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,104

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 5,165 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

5,165

$1.110

-

-

-

Semicontronic

India . 8,016 parts In-Stock

1+ parts

$2.150

100+ parts

$2.096

1k+ parts

$2.086

10k+ parts

-

8,016

$2.150

$2.096

$2.086

-

Ampacity Inc.

Singapore . 7,899 parts In-Stock

1+ parts

$2.150

100+ parts

-

1k+ parts

-

10k+ parts

-

7,899

$2.150

-

-

-

Corphita

USA . 2,201 parts In-Stock

1+ parts

$2.277

100+ parts

-

1k+ parts

-

10k+ parts

-

2,201

$2.277

-

-

-

Corohmni

South Africa . 179 parts In-Stock

1+ parts

$2.530

100+ parts

-

1k+ parts

-

10k+ parts

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179

$2.530

-

-

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Argo Parts USA

USA . 3,316 parts In-Stock

1+ parts

$3.376

100+ parts

-

1k+ parts

-

10k+ parts

-

3,316

$3.376

-

-

-

Continental Prestige Electronics

USA . 711 parts In-Stock

1+ parts

$3.376

100+ parts

-

1k+ parts

-

10k+ parts

$3.309

711

$3.376

-

-

$3.309

Microchip USA

USA . 9,141 parts In-Stock

1+ parts

$16.380

100+ parts

-

1k+ parts

-

10k+ parts

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9,141

$16.380

-

-

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Lixinc

USA . 14,480 parts In-Stock

1+ parts

-

100+ parts

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14,480

-

-

-

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SupplyDigital Components

Austria . 7,889 parts In-Stock

1+ parts

-

100+ parts

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7,889

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 3,100 parts In-Stock

1+ parts

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3,100

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-

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TANS Electronics

Latvia . 1,784 parts In-Stock

1+ parts

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1,784

-

-

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Problanco Electronics

Mexico . 1,662 parts In-Stock

1+ parts

-

100+ parts

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1,662

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-

-

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UHIMA Technologies

Türkiye . 926 parts In-Stock

1+ parts

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926

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Perfect Parts

USA . 762 parts In-Stock

1+ parts

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762

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$1.845

1k+ parts

$1.708

10k+ parts

$1.708

300

-

$1.845

$1.708

$1.708

Overview

The AFGHL50T65SQD by Onsemi is a high-quality Insulated Gate Bipolar Transistor (IGBT) that offers exceptional performance and reliability. Manufactured by Onsemi, a leader in the industry, this product is designed to meet the demanding requirements of power control applications. With its N-channel configuration and built-in diode, it provides seamless power control and efficient operation. The AFGHL50T65SQD is known for its low VCEsat of 2.1V and fast turn-on/off times, ensuring optimal performance. Its maximum collector-emitter voltage of 650V and maximum collector current of 80A make it suitable for a wide range of applications. Trust Onsemi's expertise and choose the AFGHL50T65SQD for your power control needs. Experience the value, benefits, and advantages that this top-of-the-line IGBT offers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances the durability and thermal stability of the IGBT, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient power control, making this IGBT suitable for applications that require precise control over power outputs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces component count, making this IGBT a convenient choice for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT offers high performance and reliability in regulating and modulating power outputs.

Maximum VCEsat: 2.1 V

With a low VCEsat value, this IGBT minimizes power losses and improves energy efficiency, making it an excellent choice for power-sensitive devices.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and integration into various circuit designs, offering flexibility and convenience during the product assembly process.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies soldering and ensures secure electrical connections, making this IGBT suitable for applications where robust connections are required.

Nominal Turn Off Time (toff): 134 ns

With a fast turn-off time, this IGBT enables efficient switching, reducing power dissipation and contributing to improved overall system performance.

No. of Terminals: 3

The presence of three terminals allows for proper electrical connections and control, making this IGBT versatile and suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 268 W

With a high power dissipation capability, this IGBT can handle significant power loads, making it a reliable choice for high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style facilitates secure mechanical mounting, ensuring stability and reliability, making this IGBT suitable for rugged environments.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand demanding thermal conditions, making it ideal for applications where temperature variations are expected.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage rating allows for efficient control and handling of high-voltage signals, making this IGBT suitable for voltage regulation applications.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high conductivity and performance, making this IGBT a reliable choice for power control applications.

Maximum Gate-Emitter Voltage: 20 V

With a high maximum gate-emitter voltage, this IGBT provides a wide control range and enhances its compatibility with various control systems, making it suitable for diverse applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the IGBT's functionality and reliability even in extreme cold environments, making it suitable for various operating conditions.

Maximum Collector Current (IC): 80 A

With a high maximum collector current rating, this IGBT can handle significant current loads, making it suitable for applications that require high current switching capabilities.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

The high maximum gate-emitter threshold voltage ensures precise and stable gate control, making this IGBT well-suited for applications that demand accurate switching behavior.

Terminal Finish: Matte Tin (Sn) - annealed

The annealed matte tin terminal finish offers reliable solderability and corrosion resistance, enhancing the IGBT's durability and maintenance-free operation.

Terminal Position: SINGLE

The single terminal position simplifies the IGBT's installation and alignment, making it suitable for applications with space constraints or where a single point of connection is preferred.

Nominal Turn On Time (ton): 49 ns

With a fast turn-on time, this IGBT enables efficient switching and reduces power losses, contributing to improved overall system performance.

Reference Standard: AEC-Q101

Complying with the AEC-Q101 standard ensures that this IGBT meets the stringent quality and reliability requirements for automotive applications, making it a dependable choice for automotive power control systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL50T65SQD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

134 ns

Nominal Turn On Time (ton):

49 ns

Maximum VCEsat:

2.1 V

Trade Compliance

AFGHL50T65SQD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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