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AFGH40T65SQDN

Onsemi

AFGH40T65SQDN by Onsemi

AFGH40T65SQDN by Onsemi is an N-CHANNEL IGBT with 650V VCE, 80A IC, and 238W Ptot. Ideal for general purpose switching applications due to its fast ton of 27.2ns and low toff of 88.8ns. Its AEC-Q101 standard makes it suitable for automotive electronics in a FLANGE MOUNT package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,034 parts In-Stock

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Vyrian

USA . 715 parts In-Stock

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715

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Distributors (Availability)

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Native Components

USA . 411 parts In-Stock

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$172.500

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$165.600

411

$172.500

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$165.600

Northwest PG Solutions

USA . 1,110 parts In-Stock

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$189.750

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$189.750

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SupplyDigital Components

Austria . 6,692 parts In-Stock

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Problanco Electronics

Mexico . 5,065 parts In-Stock

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TANS Electronics

Latvia . 5,055 parts In-Stock

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Kulean Microsystems

USA . 3,114 parts In-Stock

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Corphita

USA . 2,391 parts In-Stock

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UHIMA Technologies

Türkiye . 450 parts In-Stock

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Corohmni

South Africa . 387 parts In-Stock

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Overview

Discover the AFGH40T65SQDN by Onsemi, a high-quality Insulated Gate Bipolar Transistor designed for general purpose switching applications. With a single configuration and built-in diode, this transistor offers efficient performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product ensures superior quality and durability. Perfect for a wide range of industrial applications, the AFGH40T65SQDN provides customers with value, benefits, and advantages that can't be matched. Upgrade your switching systems with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation for the components, ensuring safe operation.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capability and low on-state voltage drop.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and enhances overall efficiency.

Transistor Application: GENERAL PURPOSE SWITCHING

Versatile usage in various switching applications.

Package Shape: RECTANGULAR

Allows for easy mounting and integration into the circuit.

Nominal Turn Off Time (toff): 88.8 ns

Fast turn off time ensures quick switching performance.

Maximum Power Dissipation (Abs): 238 W

High power dissipation capability for demanding applications.

Package Style (Meter): FLANGE MOUNT

Facilitates secure mounting and heat dissipation.

Maximum Operating Temperature: 175 °C

Suitable for operation in high-temperature environments.

Maximum Collector-Emitter Voltage: 650 V

Supports high voltage applications with safety margin.

Transistor Element Material: SILICON

Silicon offers good thermal conductivity and efficiency.

Maximum Gate-Emitter Voltage: 20 V

Ensures safe operation within specified voltage limits.

Minimum Operating Temperature: -55 °C

Operates efficiently in low-temperature conditions.

Maximum Collector Current (IC): 80 A

Handles high current loads with ease.

Terminal Finish: Tin (Sn)

Provides good electrical conductivity and corrosion resistance.

Terminal Position: SINGLE

Simplifies connection and integration into the circuit.

Case Connection: ISOLATED

Ensures electrical isolation and safety in operation.

Nominal Turn On Time (ton): 27.2 ns

Fast turn on time for quick response in switching operations.

Reference Standard: AEC-Q101

Meets automotive quality and reliability standards.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGH40T65SQDN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

GENERAL PURPOSE SWITCHING

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

88.8 ns

Nominal Turn On Time (ton):

27.2 ns

Trade Compliance

AFGH40T65SQDN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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