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AFGHL30T65RQDN

Onsemi

AFGHL30T65RQDN by Onsemi

AFGHL30T65RQDN by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.82V and a max IC of 42A. It is designed for power control applications, featuring a single configuration with built-in diode. With a max operating temperature of 175 °C, it offers high power dissipation up to 230.8W in a rectangular package style suitable for flange mount installations.

Median Price

$5.740

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 900 parts In-Stock

1+ parts

$2.570

100+ parts

$2.420

1k+ parts

$2.190

10k+ parts

-

900

$2.570

$2.420

$2.190

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DigiKey

USA . 415 parts In-Stock

1+ parts

$5.740

100+ parts

$3.245

1k+ parts

$2.292

10k+ parts

$2.204

415

$5.740

$3.245

$2.292

$2.204

Mouser Electronics

USA . 373 parts In-Stock

1+ parts

$5.740

100+ parts

-

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$2.520

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373

$5.740

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$2.520

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Flip Electronics (Authorized)

USA . 203 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 687 parts In-Stock

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$2.442

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687

$2.442

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Vyrian

USA . 4,427 parts In-Stock

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4,427

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Flip Electronics

USA . 203 parts In-Stock

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203

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Distributors (Availability)

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Corphita

USA . 1,507 parts In-Stock

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$2.313

100+ parts

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1,507

$2.313

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Corohmni

South Africa . 147 parts In-Stock

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$2.570

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147

$2.570

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Microchip USA

USA . 463 parts In-Stock

1+ parts

$32.175

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463

$32.175

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SupplyDigital Components

Austria . 6,345 parts In-Stock

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TANS Electronics

Latvia . 5,062 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 4,705 parts In-Stock

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4,705

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Problanco Electronics

Mexico . 3,612 parts In-Stock

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3,612

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Northwest PG Solutions

USA . 724 parts In-Stock

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$3.332

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724

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$3.332

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Native Components

USA . 436 parts In-Stock

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$3.298

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436

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$3.298

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UHIMA Technologies

Türkiye . 16 parts In-Stock

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Overview

Unlock the power of efficient energy management with the AFGHL30T65RQDN by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality in their Insulated Gate Bipolar Transistors (IGBT). Ideal for power control applications, this N-CHANNEL transistor offers a single configuration with a built-in diode for enhanced performance. With a maximum collector-emitter voltage of 650V and a nominal turn off time of 139ns, this transistor provides reliable power handling capabilities. Trust Onsemi to provide cutting-edge technology that meets your needs for power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and robustness are important.

Maximum VCEsat: 1.82 V

Low VCEsat helps in reducing power losses and improving overall efficiency of the device, making it suitable for power control applications.

Maximum Power Dissipation (Abs): 230.8 W

With a high power dissipation capability, this IGBT can handle high power operation without getting damaged, providing reliability in power control applications.

Maximum Collector-Emitter Voltage: 650 V

The high collector-emitter voltage rating allows the device to be used in applications with high voltage requirements, ensuring safe and reliable operation.

Minimum Operating Temperature: -55 °C

The wide operating temperature range makes this IGBT suitable for use in environments with extreme temperatures, enhancing its versatility.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL30T65RQDN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.3 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

139 ns

Nominal Turn On Time (ton):

48 ns

Maximum VCEsat:

1.82 V

Trade Compliance

AFGHL30T65RQDN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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