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AFGHL40T65SQD

Onsemi

AFGHL40T65SQD by Onsemi

AFGHL40T65SQD by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.1V, IC of 80A, and VCE of 650V. Ideal for power control applications, it has a max power dissipation of 238W and operates b/w -55 to 175 °C.

Median Price

$5.558

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,656 parts In-Stock

1+ parts

$7.190

100+ parts

-

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$2.970

10k+ parts

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6,656

$7.190

-

$2.970

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DigiKey

USA . 2,122 parts In-Stock

1+ parts

$7.190

100+ parts

$4.138

1k+ parts

$2.975

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2,122

$7.190

$4.138

$2.975

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Rochester

USA . 329 parts In-Stock

1+ parts

-

100+ parts

$2.980

1k+ parts

$2.670

10k+ parts

$2.510

329

-

$2.980

$2.670

$2.510

Verical

USA . 219 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.337

10k+ parts

$3.138

219

-

$3.925

$3.337

$3.138

Distributors (In-Stock)

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Digiode

USA . 983 parts In-Stock

1+ parts

$3.144

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983

$3.144

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Vyrian

USA . 232 parts In-Stock

1+ parts

$3.310

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232

$3.310

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Flip Electronics

USA . 9,450 parts In-Stock

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9,450

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Avant Electronics Limited

UK . 3,742 parts In-Stock

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3,742

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Distributors (Availability)

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Native Components

USA . 91 parts In-Stock

1+ parts

$0.553

100+ parts

-

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91

$0.553

-

-

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Northwest PG Solutions

USA . 1,279 parts In-Stock

1+ parts

$0.609

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1,279

$0.609

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Corphita

USA . 2,163 parts In-Stock

1+ parts

$2.979

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2,163

$2.979

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Corohmni

South Africa . 144 parts In-Stock

1+ parts

$3.310

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144

$3.310

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Ampacity Inc.

Singapore . 4,976 parts In-Stock

1+ parts

$6.120

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4,976

$6.120

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Microchip USA

USA . 11,812 parts In-Stock

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TANS Electronics

Latvia . 6,985 parts In-Stock

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Kulean Microsystems

USA . 6,129 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,504 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,341 parts In-Stock

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3,341

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SupplyDigital Components

Austria . 2,266 parts In-Stock

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2,266

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iodParts Technologies Inc.

India . 2,045 parts In-Stock

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Perfect Parts

USA . 818 parts In-Stock

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818

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UHIMA Technologies

Türkiye . 712 parts In-Stock

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712

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$1.239

1k+ parts

$1.147

10k+ parts

$1.147

150

-

$1.239

$1.147

$1.147

Overview

Unleash the power of the AFGHL40T65SQD by Onsemi, a top-tier manufacturer in the world of Insulated Gate Bipolar Transistors. This single N-channel IGBT with a built-in diode is designed for optimal power control applications, boasting a maximum VCEsat of 2.1V and a maximum collector-emitter voltage of 650V. With a maximum operating temperature of 175 °C and a maximum power dissipation of 238W, this product delivers unrivaled performance and reliability. Whether you're working on industrial machinery, renewable energy systems, or automotive electronics, the AFGHL40T65SQD offers the value, benefits, and advantages that customers need to succeed in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, enhancing durability and reliability of the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and power control capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by having a diode integrated within the same package, saving space and reducing component count.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimized performance and efficiency.

Maximum VCEsat: 2.1 V

Low collector-emitter saturation voltage helps in reducing power losses and improving overall efficiency of the device.

Package Shape: RECTANGULAR

Allows for easy integration and mounting within various electronic systems.

Terminal Form: THROUGH-HOLE

Facilitates easy and secure soldering onto circuit boards, ensuring strong connections.

Maximum Power Dissipation (Abs): 238 W

Can handle high power levels, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Enables simple and effective mounting onto heatsinks or other cooling solutions for heat dissipation.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures, suitable for industrial environments.

Maximum Collector-Emitter Voltage: 650 V

Supports high voltage levels, making it versatile for a wide range of applications.

Transistor Element Material: SILICON

Provides good electrical properties and reliability for the transistor.

Maximum Gate-Emitter Voltage: 20 V

Safe operating voltage for gate control, ensuring stable and reliable performance.

Minimum Operating Temperature: -55 °C

Capable of withstanding low temperatures, suitable for automotive and industrial applications.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling of large currents, ideal for power applications.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Optimal threshold voltage for gate control, ensuring proper switching characteristics.

Terminal Finish: Matte Tin (Sn) - annealed

Provides good solderability and conductivity for secure connections.

Terminal Position: SINGLE

Simplifies installation and connection within circuit designs.

Case Connection: COLLECTOR

Clear indication of the connection point for ease of circuit design.

Reference Standard: AEC-Q101

Compliance with automotive electronics standards ensures reliability and quality for automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL40T65SQD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.1 V

Trade Compliance

AFGHL40T65SQD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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