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AFGH50T65SQDN

Onsemi

AFGH50T65SQDN by Onsemi

AFGH50T65SQDN by Onsemi is an N-CHANNEL IGBT with 650V max collector-emitter voltage, 100A max collector current, and 268W max power dissipation. Ideal for applications requiring high-power switching in automotive electronics due to AEC-Q101 compliance and built-in diode configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,990 parts In-Stock

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1,990

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Vyrian

USA . 776 parts In-Stock

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776

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Distributors (Availability)

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Native Components

USA . 396 parts In-Stock

1+ parts

$305.950

100+ parts

$299.831

1k+ parts

$296.772

10k+ parts

$293.712

396

$305.950

$299.831

$296.772

$293.712

Northwest PG Solutions

USA . 1,128 parts In-Stock

1+ parts

$336.545

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1,128

$336.545

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Problanco Electronics

Mexico . 8,390 parts In-Stock

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8,390

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SupplyDigital Components

Austria . 7,783 parts In-Stock

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7,783

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TANS Electronics

Latvia . 7,685 parts In-Stock

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7,685

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Kulean Microsystems

USA . 4,552 parts In-Stock

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4,552

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Corphita

USA . 720 parts In-Stock

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720

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UHIMA Technologies

Türkiye . 537 parts In-Stock

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537

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Corohmni

South Africa . 433 parts In-Stock

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Overview

Discover the high-quality AFGH50T65SQDN by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor (IGBT) designed to deliver exceptional performance and reliability. With a single configuration and built-in diode, this product is perfect for a wide range of applications. From power electronics to motor drives, the AFGH50T65SQDN offers customers a valuable solution that ensures efficient operation and long-term durability. Trust in Onsemi's reputation for excellence and choose this IGBT for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IGBT, ensuring long-term performance and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have better performance characteristics compared to P-channel IGBTs, making this product a more efficient choice for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs and provides a compact form factor for space-constrained applications.

Maximum Power Dissipation (Abs): 268 W

With a high power dissipation rating, this IGBT can handle high-power applications without risk of overheating or damage.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature enables this IGBT to withstand elevated temperatures, making it suitable for industrial applications where heat may be a concern.

Maximum Collector-Emitter Voltage: 650 V

With a high collector-emitter voltage rating, this IGBT can handle high voltage levels, making it suitable for power electronics applications.

Maximum Collector Current (IC): 100 A

The high collector current rating allows this IGBT to handle high current loads, making it suitable for power applications that require high current capacity.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 ensures that this IGBT meets automotive quality standards, making it a reliable choice for automotive applications where durability and performance are essential.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGH50T65SQDN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

GENERAL PURPOSE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

110 ns

Nominal Turn On Time (ton):

33 ns

Trade Compliance

AFGH50T65SQDN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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