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AFGHL40T120RLD

Onsemi

AFGHL40T120RLD by Onsemi

AFGHL40T120RLD by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 48A IC, and 529W power dissipation. Ideal for power control applications due to its single configuration with built-in diode. Operates b/w -55 °C to 175°C temperature range.

Median Price

$13.171

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 450 parts In-Stock

1+ parts

$15.180

100+ parts

$11.440

1k+ parts

$9.550

10k+ parts

-

450

$15.180

$11.440

$9.550

-

Chip1Stop

Japan . 106 parts In-Stock

1+ parts

$45.000

100+ parts

$21.300

1k+ parts

-

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106

$45.000

$21.300

-

-

Rochester

USA . 351,594 parts In-Stock

1+ parts

-

100+ parts

$8.960

1k+ parts

$8.020

10k+ parts

$7.540

351,594

-

$8.960

$8.020

$7.540

Verical

USA . 314,100 parts In-Stock

1+ parts

-

100+ parts

$11.162

1k+ parts

$9.988

10k+ parts

$9.400

314,100

-

$11.162

$9.988

$9.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 613 parts In-Stock

1+ parts

$9.443

100+ parts

-

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-

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613

$9.443

-

-

-

Vyrian

USA . 4,554 parts In-Stock

1+ parts

-

100+ parts

-

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4,554

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-

-

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Flip Electronics

USA . 450 parts In-Stock

1+ parts

-

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-

1k+ parts

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450

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 100 parts In-Stock

1+ parts

$1.488

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.488

-

-

-

Northwest PG Solutions

USA . 926 parts In-Stock

1+ parts

$1.637

100+ parts

-

1k+ parts

-

10k+ parts

-

926

$1.637

-

-

-

Corphita

USA . 1,765 parts In-Stock

1+ parts

$8.946

100+ parts

-

1k+ parts

-

10k+ parts

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1,765

$8.946

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-

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Corohmni

South Africa . 334 parts In-Stock

1+ parts

$9.940

100+ parts

-

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-

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334

$9.940

-

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Microchip USA

USA . 9,163 parts In-Stock

1+ parts

$30.793

100+ parts

-

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9,163

$30.793

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-

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Problanco Electronics

Mexico . 5,041 parts In-Stock

1+ parts

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100+ parts

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5,041

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-

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TANS Electronics

Latvia . 3,979 parts In-Stock

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3,979

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Kulean Microsystems

USA . 3,340 parts In-Stock

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3,340

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SupplyDigital Components

Austria . 1,935 parts In-Stock

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1,935

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Perfect Parts

USA . 1,870 parts In-Stock

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1,870

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UHIMA Technologies

Türkiye . 474 parts In-Stock

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474

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GreenTree Electronics

Israel . 206 parts In-Stock

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206

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Authorized Procurement Solutions

USA . 119 parts In-Stock

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119

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Overview

Unleash the power of innovation with the AFGHL40T120RLD by Onsemi, a top-tier manufacturer known for its cutting-edge technology and high-quality products. As part of the Insulated Gate Bipolar Transistors (IGBT) category, this single N-CHANNEL transistor with a built-in diode is perfect for power control applications. With a maximum collector-emitter voltage of 1200V and a maximum operating temperature of 175 °C, this product offers unmatched performance and reliability. Experience seamless power management and efficiency with the AFGHL40T120RLD, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the components within the transistor, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to prevent reverse current flow and enhances the overall efficiency of the power control circuit.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, making it a reliable choice for controlling high power loads.

Maximum VCEsat: 2.1 V

Low VCEsat value indicates lower conduction losses and higher efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust and reliable connections for easy installation and soldering.

Nominal Turn Off Time (toff): 276 ns

Fast turn-off time helps in reducing switching losses and improving overall efficiency of the power control circuit.

Maximum Power Dissipation (Abs): 529 W

High power dissipation capability ensures that the transistor can handle high power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy mounting and heat dissipation, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

High operating temperature rating ensures reliable performance even in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High VCE rating allows the transistor to handle high voltage applications with ease.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance, reliability, and efficiency in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures compatibility with various gate drive circuits and protects the transistor from damage.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for reliable performance in both extreme cold and hot conditions.

Maximum Collector Current (IC): 48 A

High collector current rating enables the transistor to handle high current loads without any issues.

Maximum Gate-Emitter Threshold Voltage: 7.3 V

Low gate-emitter threshold voltage ensures easy and efficient switching of the transistor.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection of the transistor in the circuit.

Case Connection: COLLECTOR

Case connected to collector helps in efficient heat dissipation, ensuring the transistor stays cool during operation.

Nominal Turn On Time (ton): 80 ns

Fast turn-on time allows for quick switching and efficient power control in high-speed applications.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high reliability and quality for automotive electronic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL40T120RLD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7.3 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

276 ns

Nominal Turn On Time (ton):

80 ns

Maximum VCEsat:

2.1 V

Trade Compliance

AFGHL40T120RLD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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