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AFGHL40T65RQDN

Onsemi

AFGHL40T65RQDN by Onsemi

AFGHL40T65RQDN by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 1.82V and a collector-emitter voltage of 650V. It is designed for power control applications, featuring a single configuration with built-in diode and a max power dissipation of 288W.

Median Price

$4.398

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 450 parts In-Stock

1+ parts

$6.220

100+ parts

-

1k+ parts

$2.960

10k+ parts

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450

$6.220

-

$2.960

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DigiKey

USA . 400 parts In-Stock

1+ parts

$6.420

100+ parts

$3.662

1k+ parts

$2.610

10k+ parts

$2.560

400

$6.420

$3.662

$2.610

$2.560

Verical

USA . 11,250 parts In-Stock

1+ parts

-

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$2.576

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11,250

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$2.576

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Flip Electronics (Authorized)

USA . 10,800 parts In-Stock

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10,800

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Rochester

USA . 58 parts In-Stock

1+ parts

-

100+ parts

$2.570

1k+ parts

$2.300

10k+ parts

$2.160

58

-

$2.570

$2.300

$2.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,741 parts In-Stock

1+ parts

$2.698

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1,741

$2.698

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Vyrian

USA . 12,129 parts In-Stock

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12,129

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Flip Electronics

USA . 11,250 parts In-Stock

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11,250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 670 parts In-Stock

1+ parts

$1.488

100+ parts

-

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670

$1.488

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Northwest PG Solutions

USA . 1,173 parts In-Stock

1+ parts

$1.637

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1,173

$1.637

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Corphita

USA . 2,326 parts In-Stock

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$2.556

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2,326

$2.556

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Corohmni

South Africa . 416 parts In-Stock

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$2.840

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416

$2.840

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Microchip USA

USA . 6,329 parts In-Stock

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$16.100

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6,329

$16.100

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Problanco Electronics

Mexico . 5,591 parts In-Stock

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5,591

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SupplyDigital Components

Austria . 5,506 parts In-Stock

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5,506

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Kulean Microsystems

USA . 4,466 parts In-Stock

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4,466

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TANS Electronics

Latvia . 3,781 parts In-Stock

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3,781

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UHIMA Technologies

Türkiye . 265 parts In-Stock

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265

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Overview

Elevate your power control solutions with the AFGHL40T65RQDN by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor with built-in diode offers unmatched performance and reliability for various applications requiring power control. With a maximum VCEsat of 1.82V and a collector current of 46A, this IGBT ensures efficient power management in a compact rectangular package. Experience the value and benefits of Onsemi's innovative technology with the AFGHL40T65RQDN - the ultimate choice for your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and longevity of the product.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel types, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling and protection against voltage spikes, enhancing the reliability of the power control system.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency in managing power flow.

Maximum VCEsat: 1.82 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to reduced power loss and improved overall efficiency.

Maximum Power Dissipation (Abs): 288 W

High power dissipation capacity allows the IGBT to handle heavy loads and high power levels without overheating or malfunctioning.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this IGBT can withstand elevated temperatures in industrial environments without performance degradation.

Maximum Collector-Emitter Voltage: 650 V

High voltage rating ensures reliable operation in high voltage applications, providing robust protection against voltage spikes or surges.

Maximum Gate-Emitter Threshold Voltage: 6.05 V

Low gate-emitter threshold voltage allows for efficient and precise control of the IGBT, leading to improved switching performance and reduced power losses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL40T65RQDN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.05 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

149 ns

Nominal Turn On Time (ton):

74 ns

Maximum VCEsat:

1.82 V

Trade Compliance

AFGHL40T65RQDN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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