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AFGHL40T65SQ

Onsemi

AFGHL40T65SQ by Onsemi

AFGHL40T65SQ by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 80A IC, and 239W power dissipation. Ideal for power control applications due to its single configuration with built-in diode. Operates b/w -55 °C to 175°C temperature range.

Median Price

$5.110

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 430 parts In-Stock

1+ parts

$5.110

100+ parts

$2.610

1k+ parts

$2.270

10k+ parts

-

430

$5.110

$2.610

$2.270

-

Newark

USA . 420 parts In-Stock

1+ parts

$6.990

100+ parts

$4.130

1k+ parts

$3.850

10k+ parts

-

420

$6.990

$4.130

$3.850

-

Element14

Singapore . 430 parts In-Stock

1+ parts

$8.600

100+ parts

$3.970

1k+ parts

$3.750

10k+ parts

-

430

$8.600

$3.970

$3.750

-

Rochester

USA . 764 parts In-Stock

1+ parts

-

100+ parts

$2.310

1k+ parts

$2.070

10k+ parts

$1.940

764

-

$2.310

$2.070

$1.940

Verical

USA . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.587

10k+ parts

$2.425

444

-

-

$2.587

$2.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 277 parts In-Stock

1+ parts

$4.246

100+ parts

-

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277

$4.246

-

-

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Vyrian

USA . 10,518 parts In-Stock

1+ parts

-

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10,518

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-

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PUI

USA . 1,350 parts In-Stock

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1,350

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Flip Electronics

USA . 450 parts In-Stock

1+ parts

-

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450

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 196 parts In-Stock

1+ parts

$0.138

100+ parts

-

1k+ parts

-

10k+ parts

$0.132

196

$0.138

-

-

$0.132

Northwest PG Solutions

USA . 1,578 parts In-Stock

1+ parts

$0.152

100+ parts

-

1k+ parts

-

10k+ parts

$0.134

1,578

$0.152

-

-

$0.134

Corphita

USA . 786 parts In-Stock

1+ parts

$4.023

100+ parts

-

1k+ parts

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786

$4.023

-

-

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Corohmni

South Africa . 482 parts In-Stock

1+ parts

$4.470

100+ parts

-

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10k+ parts

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482

$4.470

-

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Microchip USA

USA . 6,111 parts In-Stock

1+ parts

$14.504

100+ parts

-

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10k+ parts

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6,111

$14.504

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-

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SupplyDigital Components

Austria . 6,795 parts In-Stock

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6,795

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Problanco Electronics

Mexico . 6,400 parts In-Stock

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6,400

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Kulean Microsystems

USA . 5,199 parts In-Stock

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5,199

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TANS Electronics

Latvia . 1,311 parts In-Stock

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1,311

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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285

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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Overview

Enhance your power control applications with the AFGHL40T65SQ by Onsemi. As a leading manufacturer of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-quality products with a single configuration and built-in diode, ensuring maximum efficiency in your projects. With a wide operating temperature range and high collector-emitter voltage, this transistor offers unparalleled performance and reliability. Trust Onsemi to provide the best solutions for your power control needs with the AFGHL40T65SQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good thermal and mechanical properties, ensuring durability and efficient heat dissipation for the IGBT.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and faster switching speeds, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the overall performance of the IGBT.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT provides efficient and reliable performance in regulating power flow.

Maximum VCEsat: 2.1 V

Low VCEsat value indicates minimal saturation voltage, leading to lower power dissipation and increased efficiency in power switching operations.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into various electronic systems, enhancing the usability and versatility of the IGBT.

Nominal Turn Off Time (toff): 98 ns

Fast turn-off time ensures quick switching capabilities, reducing power loss and improving overall performance in high-frequency applications.

Maximum Power Dissipation (Abs): 239 W

High power dissipation rating enables the IGBT to handle large power loads without overheating, ensuring reliable operation under heavy-duty conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mechanical mounting, facilitating easy installation and enhancing the thermal management of the IGBT.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance allows the IGBT to withstand elevated heat levels, ensuring consistent performance in demanding environments.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating enables the IGBT to handle high voltage levels, making it suitable for power control applications with varying voltage requirements.

Transistor Element Material: SILICON

Silicon-based transistor element offers reliable and consistent performance, ensuring stable operation and longevity in diverse power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating provides robust protection against voltage spikes and overvoltage conditions, enhancing the durability and reliability of the IGBT.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature tolerance allows the IGBT to function effectively in cold environments or during start-up conditions, ensuring reliable operation in harsh climates.

Maximum Collector Current (IC): 80 A

High collector current rating allows the IGBT to handle significant current flows, making it suitable for high-power applications requiring efficient current regulation.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Optimal gate-emitter threshold voltage ensures precise control over the switching behavior of the IGBT, leading to stable and efficient power regulation.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides corrosion resistance and reliable electrical contact, ensuring smooth operation and longevity of the IGBT in various operating conditions.

Terminal Position: SINGLE

Single terminal position simplifies installation and connectivity, reducing complexity in circuit design and enhancing the overall usability of the IGBT.

Nominal Turn On Time (ton): 39 ns

Fast turn-on time enables quick start-up and switching speeds, improving the overall performance and efficiency of the IGBT in power control applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high-quality and reliable performance, making this IGBT suitable for automotive and industrial applications where robustness is essential.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL40T65SQ attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

98 ns

Nominal Turn On Time (ton):

39 ns

Maximum VCEsat:

2.1 V

Trade Compliance

AFGHL40T65SQ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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