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AFGHL40T65SPD

Onsemi

AFGHL40T65SPD by Onsemi

AFGHL40T65SPD by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.4V, IC of 80A, and Ptot of 267W. Ideal for POWER CONTROL applications due to its fast turn-off time (toff) of 48ns and high operating temperature range (-55 to 175 °C). Package style: FLANGE MOUNT.

Median Price

$5.445

Lifecycle Status

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17

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1k+

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Arrow

USA . 450 parts In-Stock

1+ parts

$3.869

100+ parts

$3.106

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-

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450

$3.869

$3.106

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Chip1Stop

Japan . 450 parts In-Stock

1+ parts

$4.650

100+ parts

-

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450

$4.650

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DigiKey

USA . 855 parts In-Stock

1+ parts

$5.140

100+ parts

$3.059

1k+ parts

-

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855

$5.140

$3.059

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Farnell

UK . 386 parts In-Stock

1+ parts

$5.750

100+ parts

$3.450

1k+ parts

$2.570

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-

386

$5.750

$3.450

$2.570

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Mouser Electronics

USA . 2,142 parts In-Stock

1+ parts

$5.790

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-

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$3.050

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2,142

$5.790

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$3.050

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Newark

USA . 353 parts In-Stock

1+ parts

$7.190

100+ parts

$5.120

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$4.940

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353

$7.190

$5.120

$4.940

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Element14

Singapore . 386 parts In-Stock

1+ parts

$9.350

100+ parts

$6.010

1k+ parts

$4.830

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-

386

$9.350

$6.010

$4.830

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Flip Electronics (Authorized)

USA . 240,000 parts In-Stock

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240,000

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Future Electronics

Canada . 20,250 parts In-Stock

1+ parts

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$3.230

1k+ parts

$3.180

10k+ parts

$3.120

20,250

-

$3.230

$3.180

$3.120

Verical

USA . 450 parts In-Stock

1+ parts

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450

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Avnet

USA . 420 parts In-Stock

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420

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Vyrian

USA . 308 parts In-Stock

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$3.230

100+ parts

-

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308

$3.230

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Digiode

USA . 2,420 parts In-Stock

1+ parts

$4.370

100+ parts

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2,420

$4.370

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Flip Electronics

USA . 252,900 parts In-Stock

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252,900

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ComSIT Distribution GmbH

Germany . 33,631 parts In-Stock

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33,631

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IBS Electronics

USA . 250 parts In-Stock

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$3.870

10k+ parts

$3.830

250

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$3.870

$3.830

NAC Semi

USA . 180 parts In-Stock

1+ parts

-

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$4.900

1k+ parts

$4.520

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180

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$4.900

$4.520

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Distributors (Availability)

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Native Components

USA . 307 parts In-Stock

1+ parts

$0.473

100+ parts

-

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10k+ parts

$0.454

307

$0.473

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-

$0.454

Northwest PG Solutions

USA . 637 parts In-Stock

1+ parts

$0.520

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$0.459

637

$0.520

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$0.459

Corohmni

South Africa . 215 parts In-Stock

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$3.230

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215

$3.230

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Corphita

USA . 2,197 parts In-Stock

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$4.140

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2,197

$4.140

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Component Stockers USA

USA . 1,076 parts In-Stock

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$6.410

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$4.350

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1,076

$6.410

$4.350

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Microchip USA

USA . 7,488 parts In-Stock

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$18.984

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Problanco Electronics

Mexico . 6,556 parts In-Stock

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Kulean Microsystems

USA . 5,008 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 4,688 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 1,321 parts In-Stock

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Benley Electronics

USA . 295 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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Eastek

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Overview

Unleash the power of the AFGHL40T65SPD by Onsemi, a top-tier manufacturer known for producing high-quality Insulated Gate Bipolar Transistors (IGBT). With its N-CHANNEL design and built-in diode, this transistor is perfect for power control applications. Offering a maximum Collector-Emitter Voltage of 650V, 80A Maximum Collector Current, and fast turn-on/off times, this product ensures efficient performance. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Upgrade your power control systems with the AFGHL40T65SPD and experience unmatched reliability and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good resistance to environmental factors and mechanical stress, increasing the reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against voltage spikes during switching.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and accurate control of electrical power.

Maximum VCEsat: 2.4 V

Low VCEsat helps in reducing power loss and improving efficiency of the device.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy mounting and installation in various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connection and are easier to solder onto a PCB.

Nominal Turn Off Time (toff): 48 ns

Fast turn-off time helps in reducing switching losses and improving overall system performance.

No. of Terminals: 3

Simple 3-terminal configuration makes it easy to integrate into circuits and systems.

Maximum Power Dissipation (Abs): 267 W

High power dissipation capability allows for handling high power levels without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and heat dissipation in high power applications.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for reliable operation in various environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating ensures the device can handle high voltage levels.

Transistor Element Material: SILICON

Silicon material provides good electrical performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 7.5 V

Gate-emitter voltage rating ensures safe operation within specified voltage limits.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in cold environments or during startup conditions.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling high current levels in power control applications.

Maximum Gate-Emitter Threshold Voltage: 20 V

Threshold voltage ensures proper turn-on and turn-off of the IGBT for efficient power control.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides good solderability and an annealed surface for reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and connection in power control systems.

Nominal Turn On Time (ton): 56 ns

Fast turn-on time allows for quick switching of the IGBT, improving system response time.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high quality and reliability for automotive electronic systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGHL40T65SPD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

20 V

Maximum Gate-Emitter Voltage:

7.5 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

48 ns

Nominal Turn On Time (ton):

56 ns

Maximum VCEsat:

2.4 V

Trade Compliance

AFGHL40T65SPD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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