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AFGY100T65SPD

Onsemi

AFGY100T65SPD by Onsemi

AFGY100T65SPD by Onsemi is an N-CHANNEL IGBT with 650V VCEsat and 120A IC, ideal for POWER CONTROL applications. It features a max power dissipation of 882W, operating temperature range of -55 to 175°C, and built-in diode configuration.

Median Price

$6.730

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Mouser Electronics

USA . 1,767 parts In-Stock

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$12.450

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1,767

$12.450

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DigiKey

USA . 334 parts In-Stock

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$12.460

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$7.513

1k+ parts

$6.137

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334

$12.460

$7.513

$6.137

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Newark

USA . 403 parts In-Stock

1+ parts

$15.380

100+ parts

$9.590

1k+ parts

$9.300

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403

$15.380

$9.590

$9.300

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Verical

USA . 3,150 parts In-Stock

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$6.175

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Arrow

USA . 1,350 parts In-Stock

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$6.366

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1,350

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$6.366

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Chip1Stop

Japan . 1,350 parts In-Stock

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$6.730

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$6.620

1,350

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$6.730

$6.620

Future Electronics

Canada . 900 parts In-Stock

1+ parts

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$6.120

1k+ parts

$6.020

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900

-

$6.120

$6.020

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.096

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100

$7.096

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Digiode

USA . 799 parts In-Stock

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$10.317

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799

$10.317

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VNN

France . 26,953 parts In-Stock

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Flip Electronics

USA . 2,250 parts In-Stock

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IBS Electronics

USA . 2,250 parts In-Stock

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$8.752

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$8.724

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2,250

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$8.724

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Vyrian

USA . 748 parts In-Stock

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748

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NAC Semi

USA . 720 parts In-Stock

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$12.580

1k+ parts

$11.440

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720

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$12.580

$11.440

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,069 parts In-Stock

1+ parts

$4.940

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1,069

$4.940

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Corohmni

South Africa . 89 parts In-Stock

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$6.730

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89

$6.730

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Continental Prestige Electronics

USA . 4,530 parts In-Stock

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$7.096

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$6.954

4,530

$7.096

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$6.954

Netroflash

USA . 100 parts In-Stock

1+ parts

$7.096

100+ parts

-

1k+ parts

$6.742

10k+ parts

$6.600

100

$7.096

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$6.742

$6.600

Corphita

USA . 2,210 parts In-Stock

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$9.774

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$9.774

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Microchip USA

USA . 11,521 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 6,120 parts In-Stock

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TANS Electronics

Latvia . 5,970 parts In-Stock

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iodParts Technologies Inc.

India . 2,184 parts In-Stock

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Problanco Electronics

Mexico . 1,747 parts In-Stock

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Kulean Microsystems

USA . 1,018 parts In-Stock

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Argo Parts USA

USA . 966 parts In-Stock

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UHIMA Technologies

Türkiye . 260 parts In-Stock

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Perfect Parts

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Overview

Experience the unmatched quality and reliability of Onsemi with the AFGY100T65SPD Insulated Gate Bipolar Transistor. Designed for power control applications, this N-CHANNEL transistor offers a maximum VCEsat of 2.05V and a collector-emitter voltage of 650V, ensuring optimal performance in the most demanding conditions. With a maximum power dissipation of 882W, this single configuration transistor with a built-in diode is a game-changer in the industry. Trust Onsemi for cutting-edge technology that delivers efficiency and precision in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the transistor, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and operation in a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, reducing component count and overall size.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimized performance in controlling high power loads.

Maximum VCEsat: 2.05 V

Low saturation voltage results in minimal power loss and high efficiency in power control applications.

Package Shape: RECTANGULAR

Compact rectangular shape allows for easy mounting and integration into circuit boards.

Terminal Form: THROUGH-HOLE

Enables secure and reliable electrical connections, suitable for industrial applications.

No. of Terminals: 3

Simple 3-terminal design for easy integration and connection in circuit designs.

Maximum Power Dissipation (Abs): 882 W

High power dissipation capability allows for handling of large power loads and extended operation.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure mechanical attachment for industrial applications.

Maximum Operating Temperature: 175 °C

Wide temperature range allows for operation in harsh environments with high reliability.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating enables handling of high voltage operation.

Transistor Element Material: SILICON

Silicon material provides high efficiency and reliability for power control applications.

Maximum Gate-Emitter Voltage: 20 V

Safe operating voltage for gate-emitter ensures protection against overvoltage conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range enables operation in extreme cold environments with consistent performance.

Maximum Collector Current (IC): 120 A

High collector current rating allows for handling of large current loads with ease.

Maximum Gate-Emitter Threshold Voltage: 6.3 V

Threshold voltage ensures proper turn-on of the transistor for effective power control.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides corrosion resistance and enhanced solderability for reliable connections.

Terminal Position: SINGLE

Single terminal position streamlines connection and integration into circuit designs.

Reference Standard: AEC-Q101

Compliance with automotive quality standard ensures high reliability and performance in automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AFGY100T65SPD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.3 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.05 V

Trade Compliance

AFGY100T65SPD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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