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IRG4PC50WPBF

Infineon Technologies

IRG4PC50WPBF by Infineon Technologies

IRG4PC50WPBF by Infineon is an N-CHANNEL IGBT transistor with 600V VCE, 55A IC, and 200W power dissipation. Ideal for POWER CONTROL applications due to its fast switching times (toff:177ns, tf:86ns) and high operating temperature range (-55°C to 150°C).

Median Price

$5.221

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$3.763

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100

$3.763

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Digiode

USA . 375 parts In-Stock

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$6.678

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375

$6.678

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Chip Stock

USA . 131 parts In-Stock

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131

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Huijzer Components

Netherlands . 30 parts In-Stock

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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Vyrian

USA . 6 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 14,352 parts In-Stock

1+ parts

$3.627

100+ parts

$3.482

1k+ parts

$3.337

10k+ parts

-

14,352

$3.627

$3.482

$3.337

-

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$3.763

100+ parts

$3.575

1k+ parts

$3.396

10k+ parts

$3.349

500

$3.763

$3.575

$3.396

$3.349

Continental Prestige Electronics

USA . 259 parts In-Stock

1+ parts

$3.763

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$3.688

259

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$3.688

Argo Parts USA

USA . 107 parts In-Stock

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$3.763

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$3.763

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AZTECH Wire

Italy . 568 parts In-Stock

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$5.064

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568

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$5.980

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Corphita

USA . 398 parts In-Stock

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$6.327

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Perfect Parts

USA . 16,206 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,922 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,281 parts In-Stock

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S.R.D Solutions

India . 2,000 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Upgrade your power control systems with the reliable IRG4PC50WPBF Insulated Gate Bipolar Transistor by Infineon Technologies. This N-CHANNEL transistor offers a maximum collector-emitter voltage of 600V and a maximum collector current of 55A, making it perfect for high-power applications. With a maximum operating temperature of 150°C and quick turn-on/turn-off times, this transistor ensures efficient performance and minimal heat dissipation. Trust in Infineon Technologies for quality components that deliver exceptional value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower on-state voltage drop and higher switching speeds compared to P-CHANNEL, making them more efficient for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring efficient and reliable performance in managing power.

Maximum VCEsat: 2.3 V

Low VCEsat reduces power loss and improves efficiency during operation.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capability allows for handling of high power loads without overheating.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltages safely, making it suitable for a wide range of applications.

Maximum Gate-Emitter Voltage: 20 V

Safe operating voltage range for the gate signal, ensuring proper control and switching of the transistor.

Maximum Collector Current (IC): 55 A

High collector current rating allows for handling large current loads, making it versatile for various power control tasks.

Case Connection: COLLECTOR

Collector case connection provides efficient heat dissipation, helping to keep the transistor cool during operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC50WPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

86 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

266 ns

Nominal Turn Off Time (toff):

177 ns

Nominal Turn On Time (ton):

79 ns

Maximum VCEsat:

2.3 V

Trade Compliance

IRG4PC50WPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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