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IRG4BC20UD-SPBF

Infineon Technologies

IRG4BC20UD-SPBF by Infineon Technologies

IRG4BC20UD-SPBF by Infineon Technologies is an N-channel IGBT with a max collector-emitter voltage of 600V and a max gate-emitter voltage of 20V. It has a single configuration with built-in diode, suitable for power control applications. This transistor offers a fast turn-off time of 320ns and can handle a max collector current of 13A.

Median Price

$1.953

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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$1.953

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450

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Vyrian

USA . 964 parts In-Stock

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964

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Digiode

USA . 460 parts In-Stock

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460

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Euro-Tech

UK . 254 parts In-Stock

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ComSIT Distribution GmbH

Germany . 70 parts In-Stock

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70

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ComSIT USA

USA . 70 parts In-Stock

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70

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 15,692 parts In-Stock

1+ parts

$0.809

100+ parts

$0.777

1k+ parts

$0.744

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15,692

$0.809

$0.777

$0.744

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Aztec Data Supply Inc.

USA . 5,729 parts In-Stock

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$0.948

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$0.948

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Continental Prestige Electronics

USA . 4,121 parts In-Stock

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$1.186

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$1.162

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Argo Parts USA

USA . 2,433 parts In-Stock

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$1.186

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Corohmni

South Africa . 799 parts In-Stock

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$1.376

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AZTECH Wire

Italy . 538 parts In-Stock

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$8.218

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Ampacity Inc.

Singapore . 1,524 parts In-Stock

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$60.050

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Component Stockers USA

USA . 783 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Perfect Parts

USA . 558 parts In-Stock

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Corphita

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Overview

Unlock the power of advanced technology with the IRG4BC20UD-SPBF from Infineon Technologies. Designed for high-performance power control applications, this Insulated Gate Bipolar Transistor offers unparalleled reliability and efficiency. With a maximum collector-emitter voltage of 600V and a maximum power dissipation of 60W, this N-channel transistor is perfect for demanding environments. Experience seamless operation and enhanced performance with the IRG4BC20UD-SPBF, a game-changer in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and helps in reducing thermal resistance, making the product durable and efficient.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency by providing a freewheeling path for inductive loads, reducing voltage spikes.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability when handling high power levels.

Surface Mount: YES

Easy to assemble and saves PCB space, offering more flexibility in design and providing better thermal characteristics.

Package Shape: RECTANGULAR

Rectangular shape allows for easier placement on PCB and efficient heat dissipation, enhancing overall product performance.

Maximum Fall Time (tf): 170 ns

Fast fall time ensures quick turn-off of the transistor, reducing switching losses and improving efficiency in power control applications.

Nominal Turn Off Time (toff): 320 ns

Low turn-off time ensures efficient switching operation, reducing power dissipation and improving overall performance.

No. of Terminals: 2

Simpler to integrate into circuits and reduces chances of errors during installation.

Maximum Power Dissipation (Abs): 60 W

Higher power dissipation capability allows for handling of high power levels without compromising reliability.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the PCB, ideal for applications with size constraints without sacrificing performance.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures reliable performance in a variety of environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating allows for use in applications requiring high voltage handling capability.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stable and consistent performance over time.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating provides robustness in circuit design, allowing for safe operation under varying conditions.

Maximum Collector Current (IC): 13 A

High collector current rating enables handling of high current loads without overheating or performance degradation.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage allows for efficient turn-on of the transistor, reducing conduction losses and improving performance.

Terminal Finish: MATTE TIN OVER NICKEL

Matte tin over nickel finish provides good solderability and corrosion resistance, ensuring reliable connections in various operating conditions.

Terminal Position: SINGLE

Simplified layout and wiring, reducing chances of errors during installation and improving reliability.

Case Connection: COLLECTOR

Collector connection simplifies circuit design and layout, allowing for easier integration into power control circuits.

Maximum Time At Peak Reflow Temperature (s): 30

Designed for easy and quick assembly processes, saving time and ensuring proper soldering for reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature for robust solder joints, ensuring durability and reliability in harsh operating environments.

Nominal Turn On Time (ton): 55 ns

Low turn-on time ensures quick activation of the transistor, reducing switching losses and improving efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC20UD-SPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

170 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

320 ns

Nominal Turn On Time (ton):

55 ns

Trade Compliance

IRG4BC20UD-SPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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