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FF450R12KT4F

Infineon Technologies

FF450R12KT4F by Infineon Technologies

Infineon's FF450R12KT4F is an N-Channel IGBT with VCEsat of 2.15V, IC of 580A, and Ptot of 2400W. Ideal for high-power applications requiring fast switching such as industrial motor drives and renewable energy systems due to its low turn-off time (720ns) and high collector-emitter voltage (1200V).

Median Price

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3

In-Stock Inventory

1k+

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Digiode

USA . 646 parts In-Stock

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Vyrian

USA . 473 parts In-Stock

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Nova Conductors

Japan . 77 parts In-Stock

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Modulus Dynamics

Lithuania . 6,224 parts In-Stock

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$0.460

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$0.442

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$0.423

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$0.796

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$0.756

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$0.756

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450

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Aztec Data Supply Inc.

USA . 3,021 parts In-Stock

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$0.910

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Corohmni

South Africa . 147 parts In-Stock

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$1.447

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AZTECH Wire

Italy . 315 parts In-Stock

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$19.163

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Ampacity Inc.

Singapore . 581 parts In-Stock

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$26.050

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Semicontronic

India . 656 parts In-Stock

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$62.050

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$60.499

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$60.188

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Argo Parts USA

USA . 4,917 parts In-Stock

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Continental Prestige Electronics

USA . 4,380 parts In-Stock

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Corphita

USA . 861 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unleash the power of innovation with the FF450R12KT4F by Infineon Technologies. This top-of-the-line Insulated Gate Bipolar Transistor (IGBT) offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. From industrial automation to renewable energy systems, this N-Channel transistor delivers superior efficiency and maximum power dissipation of 2400W. Trust in Infineon Technologies to provide you with cutting-edge technology that exceeds expectations and propels your projects to new heights. Choose the FF450R12KT4F and experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type: N-Channel

N-channel IGBTs typically have lower conduction losses and higher switching speeds, making them a good choice for high efficiency applications.

Maximum VCEsat: 2.15 V

Low VCEsat helps in reducing power dissipation and improving overall efficiency of the circuit.

Nominal Turn Off Time (toff): 720 ns

Fast turn-off time helps in reducing switching losses and improving overall performance of the IGBT.

Maximum Power Dissipation (Abs): 2400 W

High power dissipation capability allows the IGBT to handle heavy loads and high power applications.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures reliability and suitability for various industrial environments.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows the IGBT to handle high voltage applications.

Transistor Element Material: SILICON

Silicon-based IGBTs offer good thermal stability and reliability for long-term operation.

Maximum Gate-Emitter Voltage: 20 V

Wide gate-emitter voltage range allows for flexible gate control and reliable operation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the IGBT can be used in cold environments without performance degradation.

Maximum Collector Current (IC): 580 A

High collector current rating makes this IGBT suitable for high power applications and heavy load circuits.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Low gate-emitter threshold voltage ensures efficient and reliable switching operation.

Case Connection: ISOLATED

Isolated case connection helps in preventing short circuits and improving safety in high voltage applications.

Nominal Turn On Time (ton): 230 ns

Fast turn-on time allows for quick switching and efficient operation of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R12KT4F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

720 ns

Nominal Turn On Time (ton):

230 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FF450R12KT4F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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