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FF450R17ME4BOSA1

Infineon Technologies

FF450R17ME4BOSA1 by Infineon Technologies

FF450R17ME4BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and thermistor. It has a max voltage of 1700V, max current of 600A, and turn off time of 1600ns. Ideal for power control applications due to its high operating temperature of 175°C and fast turn on time of 380ns.

Median Price

$207.245

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 2 parts In-Stock

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$110.750

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$110.750

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Arrow

USA . 5 parts In-Stock

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$137.930

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5

$137.930

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DigiKey

USA . 6 parts In-Stock

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$159.330

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6

$159.330

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Chip1Stop

Japan . 10 parts In-Stock

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$200.000

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10

$200.000

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Verical

USA . 35 parts In-Stock

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$207.245

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$179.536

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35

$207.245

$179.536

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Rochester

USA . 19 parts In-Stock

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$219.190

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$206.040

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$186.310

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19

$219.190

$206.040

$186.310

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Element14

Singapore . 4 parts In-Stock

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$228.720

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$228.720

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Newark

USA . 56 parts In-Stock

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$369.580

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56

$369.580

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RS (Exports)

UK . 4 parts In-Stock

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$280.859

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4

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$280.859

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Distributors (In-Stock)

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Digiode

USA . 264 parts In-Stock

1+ parts

$105.212

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264

$105.212

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Nova Conductors

Japan . 10 parts In-Stock

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$362.243

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10

$362.243

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Vyrian

USA . 4,845 parts In-Stock

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Chip Stock

USA . 359 parts In-Stock

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Corohmni

South Africa . 817 parts In-Stock

1+ parts

$0.955

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817

$0.955

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Modulus Dynamics

Lithuania . 23,454 parts In-Stock

1+ parts

$1.201

100+ parts

$1.153

1k+ parts

$1.105

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23,454

$1.201

$1.153

$1.105

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Aztec Data Supply Inc.

USA . 186 parts In-Stock

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$1.950

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$1.950

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AZTECH Wire

Italy . 754 parts In-Stock

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$5.350

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$5.350

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Ampacity Inc.

Singapore . 15 parts In-Stock

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$94.140

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15

$94.140

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Semicontronic

India . 8 parts In-Stock

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$94.140

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$91.786

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$91.316

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8

$94.140

$91.786

$91.316

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Corphita

USA . 713 parts In-Stock

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$99.675

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713

$99.675

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Continental Prestige Electronics

USA . 40 parts In-Stock

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$267.180

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$267.180

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Component Stockers USA

USA . 90 parts In-Stock

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$276.790

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90

$276.790

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Argo Parts USA

USA . 2,369 parts In-Stock

1+ parts

$362.243

100+ parts

$358.621

1k+ parts

$354.999

10k+ parts

$351.376

2,369

$362.243

$358.621

$354.999

$351.376

Netroflash

USA . 500 parts In-Stock

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$362.243

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500

$362.243

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$369.488

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$369.488

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$369.488

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900

$369.488

$369.488

$369.488

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Microchip USA

USA . 5,384 parts In-Stock

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$551.280

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5,384

$551.280

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RC Electronics

USA . 123 parts In-Stock

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$324.820

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$296.480

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$287.580

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$324.820

$296.480

$287.580

Perfect Parts

USA . 11 parts In-Stock

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Overview

Unlock the power of precision and performance with the FF450R17ME4BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor boasts a series-connected, center tap configuration with built-in diode and thermistor, making it ideal for power control applications. With a maximum collector-emitter voltage of 1700V and a maximum collector current of 600A, this transistor offers unmatched value, efficiency, and versatility to customers seeking cutting-edge technology for their projects.

Feature Benefit Bullets

Polarity: N-CHANNEL

, provides better performance and efficiency for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

, offers improved reliability and functionality for complex circuit designs.

Transistor Application: POWER CONTROL

, ideal for high-power applications requiring precise control and efficiency.

Package Shape: RECTANGULAR

, facilitates easy mounting and integration into various electronic systems.

No. of Elements: 2

, enables greater flexibility and customization in circuit design.

Nominal Turn Off Time (toff): 1600 ns

, allows for precise switching and control of power flow.

No. of Terminals: 11

, provides ample connectivity options for versatile system integration.

Package Style (Meter): FLANGE MOUNT

, ensures secure and stable mounting for reliable operation.

Maximum Operating Temperature: 175 °C

, suitable for demanding industrial environments with high operating temperatures.

Maximum Collector-Emitter Voltage: 1700 V

, can handle high voltage levels with ease, making it suitable for power control applications.

Transistor Element Material: SILICON

, offers high reliability and performance for long-term operation.

Maximum Collector Current (IC): 600 A

, capable of handling high current loads for power-intensive applications.

Terminal Position: UPPER

, simplifies installation and connection within a circuit layout.

Case Connection: ISOLATED

, enhances safety and protection by isolating the transistor elements from the external environment.

Nominal Turn On Time (ton): 380 ns

, ensures fast and efficient switching for optimal power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R17ME4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1600 ns

Nominal Turn On Time (ton):

380 ns

Trade Compliance

FF450R17ME4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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