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FF450R12IE4BOSA2

Infineon Technologies

FF450R12IE4BOSA2 by Infineon Technologies

FF450R12IE4BOSA2 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has a max voltage of 1200V and operates at up to 175°C. Ideal for POWER CONTROL applications, it features a turn off time of 900ns and a turn on time of 360ns.

Median Price

$436.786

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1 parts In-Stock

1+ parts

$406.154

100+ parts

$324.850

1k+ parts

$324.850

10k+ parts

$324.850

1

$406.154

$324.850

$324.850

$324.850

Arrow

USA . 1 parts In-Stock

1+ parts

$467.419

100+ parts

$325.517

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-

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-

1

$467.419

$325.517

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 358 parts In-Stock

1+ parts

$385.846

100+ parts

-

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358

$385.846

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Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$473.545

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86

$473.545

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Vyrian

USA . 2,182 parts In-Stock

1+ parts

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2,182

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TME

Poland . 2 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 14,030 parts In-Stock

1+ parts

$0.503

100+ parts

$0.483

1k+ parts

$0.463

10k+ parts

-

14,030

$0.503

$0.483

$0.463

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AZTECH Wire

Italy . 259 parts In-Stock

1+ parts

$5.713

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-

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259

$5.713

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Corphita

USA . 979 parts In-Stock

1+ parts

$365.539

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979

$365.539

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Continental Prestige Electronics

USA . 4,002 parts In-Stock

1+ parts

$473.545

100+ parts

-

1k+ parts

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10k+ parts

$464.074

4,002

$473.545

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-

$464.074

Argo Parts USA

USA . 3,763 parts In-Stock

1+ parts

$473.545

100+ parts

$468.810

1k+ parts

$464.074

10k+ parts

$459.339

3,763

$473.545

$468.810

$464.074

$459.339

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$473.545

100+ parts

-

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1,000

$473.545

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$751.380

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1

$751.380

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Overview

Unleash the power of the FF450R12IE4BOSA2 by Infineon Technologies, a cutting-edge Insulated Gate Bipolar Transistor (IGBT) designed for high-performance power control applications. With its N-CHANNEL polarity, series connected configuration, and built-in diode and thermistor, this transistor offers superior quality and reliability. Ideal for demanding environments, this IGBT boasts a maximum operating temperature of 175°C and a maximum collector-emitter voltage of 1200V. Trust in Infineon Technologies to deliver innovative solutions that provide value, efficiency, and performance. Elevate your projects with the FF450R12IE4BOSA2 and experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - provides higher efficiency and better performance compared to P-CHANNEL IGBTs.

Configuration

Series connected, center tap, 2 elements with built-in diode and thermistor - allows for more controlled power distribution and temperature monitoring.

Transistor Application

Power control - ideal for applications requiring precise power management and control.

Package Shape

Rectangular - provides easier mounting and installation in electronic circuits.

Nominal Turn Off Time (toff)

900 ns - ensures quick turn-off and minimizes power loss during switching.

No. of Terminals

7 - offers more connectivity options and flexibility in circuit design.

Package Style (Meter)

Flange mount - allows for secure and stable attachment to other components or heat sinks.

Maximum Operating Temperature

175 °C - ensures stable performance even in high temperature environments.

Maximum Collector-Emitter Voltage

1200 V - can handle high voltage applications with ease.

Transistor Element Material

Silicon - known for its durability and reliability in semiconductor devices.

Terminal Position

Upper - offers convenient access for connecting and integrating into a circuit.

Case Connection

Isolated - provides electrical insulation and prevents interference with other components.

Nominal Turn On Time (ton)

360 ns - allows for quick turn-on and efficient power delivery.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R12IE4BOSA2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

900 ns

Nominal Turn On Time (ton):

360 ns

Trade Compliance

FF450R12IE4BOSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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