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IRG4BC30FPBF

Infineon Technologies

IRG4BC30FPBF by Infineon Technologies

IRG4BC30FPBF by Infineon is an N-CHANNEL IGBT transistor with 600V max collector-emitter voltage and 31A max collector current. It has a power dissipation of 100W, turn-off time of 640ns, and fall time of 270ns. Ideal for power control applications due to its single configuration and flange mount package style.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 270 parts In-Stock

1+ parts

$1.230

100+ parts

$1.150

1k+ parts

$1.040

10k+ parts

-

270

$1.230

$1.150

$1.040

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.043

100+ parts

-

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870

$1.043

-

-

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Digiode

USA . 421 parts In-Stock

1+ parts

$1.168

100+ parts

-

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421

$1.168

-

-

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Voyager Components

USA . 580 parts In-Stock

1+ parts

$4.752

100+ parts

-

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580

$4.752

-

-

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DigiKey Marketplace

USA . 770 parts In-Stock

1+ parts

-

100+ parts

-

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770

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Ashlea Components Ltd

UK . 381 parts In-Stock

1+ parts

-

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381

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Vyrian

USA . 270 parts In-Stock

1+ parts

-

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270

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-

-

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ComSIT Distribution GmbH

Germany . 250 parts In-Stock

1+ parts

-

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-

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250

-

-

-

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ComSIT USA

USA . 250 parts In-Stock

1+ parts

-

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250

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North Shore Components

USA . 36 parts In-Stock

1+ parts

-

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-

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36

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 16,414 parts In-Stock

1+ parts

$0.538

100+ parts

$0.516

1k+ parts

$0.495

10k+ parts

-

16,414

$0.538

$0.516

$0.495

-

Continental Prestige Electronics

USA . 5,160 parts In-Stock

1+ parts

$1.043

100+ parts

-

1k+ parts

-

10k+ parts

$1.022

5,160

$1.043

-

-

$1.022

Argo Parts USA

USA . 3,947 parts In-Stock

1+ parts

$1.043

100+ parts

-

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3,947

$1.043

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Ampacity Inc.

Singapore . 270 parts In-Stock

1+ parts

$1.050

100+ parts

-

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270

$1.050

-

-

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Corphita

USA . 630 parts In-Stock

1+ parts

$1.107

100+ parts

-

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630

$1.107

-

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$1.121

100+ parts

$1.020

1k+ parts

$0.919

10k+ parts

-

10

$1.121

$1.020

$0.919

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Microchip USA

USA . 475 parts In-Stock

1+ parts

$7.280

100+ parts

-

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475

$7.280

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AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$7.676

100+ parts

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685

$7.676

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QUARKTWIN TECHNOLOGY LTD

USA . 29,754 parts In-Stock

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29,754

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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Perfect Parts

USA . 2,296 parts In-Stock

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2,296

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Kepictronics

USA . 1,600 parts In-Stock

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1,600

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

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1,100

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-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.022

1k+ parts

$0.991

10k+ parts

$0.970

500

-

$1.022

$0.991

$0.970

Overview

Unlock the power of advanced technology with the IRG4BC30FPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors designed for power control applications. This single N-channel transistor offers customers exceptional value with its high performance and reliability. Whether you're looking to optimize energy efficiency or improve system performance, the IRG4BC30FPBF is the perfect solution for your needs. Experience the benefits of Infineon's cutting-edge technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the internal components, increasing durability and reliability of the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current in the desired direction, enhancing the performance of the transistor.

Configuration: SINGLE

Simplified design and ease of integration into various circuits, making it user-friendly.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in power management tasks.

Package Shape: RECTANGULAR

Space-efficient design that can easily fit into compact electronic devices or systems.

Maximum Fall Time (tf): 270 ns

Fast fall time allows for quick switching between on and off states, improving overall efficiency of the product.

Nominal Turn Off Time (toff): 640 ns

Relatively low turn off time enhances the response time of the transistor, enabling swift control during operation.

Maximum Power Dissipation (Abs): 100 W

High power dissipation capabilities make this IGBT suitable for handling demanding power requirements.

Package Style (Meter): FLANGE MOUNT

Flange mount package style ensures secure installation and stable connection in the circuit.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, allowing for reliable performance in challenging environments.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating enables the transistor to handle substantial voltage levels, expanding its application range.

Transistor Element Material: SILICON

Silicon material offers high efficiency and reliability, ensuring consistent performance over time.

Maximum Collector Current (IC): 31 A

Capable of handling high currents, making it suitable for power control applications that require significant current flow.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, reducing complexity in circuit design.

Case Connection: COLLECTOR

Collector case connection provides a secure grounding point, enhancing stability and safety during operation.

Nominal Turn On Time (ton): 36 ns

Fast turn on time allows for quick activation of the transistor, enabling precise control and responsiveness.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC30FPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

FAST SPEED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

270 ns

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

640 ns

Nominal Turn On Time (ton):

36 ns

Trade Compliance

IRG4BC30FPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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