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IRG4BC30WPBF

Infineon Technologies

IRG4BC30WPBF by Infineon Technologies

IRG4BC30WPBF by Infineon Technologies is an N-CHANNEL IGBT transistor with a max Collector-Emitter Voltage of 600V and Max Power Dissipation of 100W. It has a Nominal Turn Off Time of 300ns, making it suitable for POWER CONTROL applications requiring fast switching speeds and high voltage handling capabilities.

Median Price

$1.399

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 436 parts In-Stock

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$1.399

100+ parts

$1.315

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$1.189

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436

$1.399

$1.315

$1.189

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Distributors (In-Stock)

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Nova Conductors

Japan . 78 parts In-Stock

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$1.234

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78

$1.234

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Digiode

USA . 898 parts In-Stock

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$1.329

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Chip Stock

USA . 11,500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,270 parts In-Stock

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ComSIT USA

USA . 3,270 parts In-Stock

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Vyrian

USA . 430 parts In-Stock

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Micros

Poland . 80 parts In-Stock

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$1.445

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$1.393

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$1.393

80

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$1.393

$1.393

LittleDiode

UK . 20 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 9,089 parts In-Stock

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$0.317

100+ parts

$0.304

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$0.292

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9,089

$0.317

$0.304

$0.292

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Continental Prestige Electronics

USA . 3,403 parts In-Stock

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$1.234

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$1.209

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$1.234

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Argo Parts USA

USA . 646 parts In-Stock

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$1.234

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Corphita

USA . 187 parts In-Stock

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$1.259

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Ampacity Inc.

Singapore . 436 parts In-Stock

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$2.590

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Microchip USA

USA . 7,113 parts In-Stock

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$8.320

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AZTECH Wire

Italy . 283 parts In-Stock

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$8.786

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QUARKTWIN TECHNOLOGY LTD

USA . 20,362 parts In-Stock

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RC Electronics

USA . 10,000 parts In-Stock

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$1.700

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$1.600

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$1.570

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Perfect Parts

USA . 6,619 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$1.209

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$1.172

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$1.148

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$1.148

Assy Fe

Spain . 80 parts In-Stock

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Overview

Experience the power of Infineon Technologies with the IRG4BC30WPBF Insulated Gate Bipolar Transistor. Designed for power control applications, this N-channel transistor offers a maximum collector-emitter voltage of 600V and a maximum gate-emitter voltage of 20V. With a package style of flange mount and a maximum operating temperature of 150°C, this transistor provides reliable performance in a variety of environments. Trust in the quality and expertise of Infineon Technologies to deliver cutting-edge technology that meets your power control needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient power control capabilities for various applications.

Configuration: SINGLE

Simplified design and ease of implementation for power control circuits.

Maximum Power Dissipation (Abs): 100 W

Capable of handling high power levels, ideal for demanding applications.

Maximum Collector-Emitter Voltage: 600 V

Suitable for high voltage applications, providing flexibility in use.

Maximum Collector Current (IC): 23 A

Can handle high current loads, ensuring efficient power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC30WPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

100 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

300 ns

Nominal Turn On Time (ton):

41 ns

Trade Compliance

IRG4BC30WPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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