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APT50GP60J

Microchip Technology

APT50GP60J by Microchip Technology

APT50GP60J by Microchip Technology is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max collector current of 100A. It has a nominal turn-off time of 202ns and a turn-on time of 55ns, making it ideal for power control applications. The transistor comes in a rectangular package style with flange mount and operates at temperatures up to 150°C.

Median Price

$29.076

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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$29.076

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Vyrian

USA . 1,266 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,613 parts In-Stock

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$1.050

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$1.050

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Semicontronic

India . 475 parts In-Stock

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$8.050

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$7.849

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$7.808

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AZTECH Wire

Italy . 551 parts In-Stock

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$16.275

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Corohmni

South Africa . 227 parts In-Stock

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$28.088

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Continental Prestige Electronics

USA . 4,225 parts In-Stock

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$28.495

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Netroflash

USA . 1,000 parts In-Stock

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$29.076

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Microchip USA

USA . 4,457 parts In-Stock

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$73.899

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QUARKTWIN TECHNOLOGY LTD

USA . 9,115 parts In-Stock

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RGB Technical Solutions

Ukraine . 4,897 parts In-Stock

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Argo Parts USA

USA . 4,596 parts In-Stock

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Perfect Parts

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Overview

Enhance your power control systems with the APT50GP60J by Microchip Technology. Built with high-quality materials and innovative technology, this Insulated Gate Bipolar Transistor (IGBT) offers reliable performance and efficiency in various applications. With a maximum collector-emitter voltage of 600V and a nominal turn-on time of 55ns, this N-channel transistor provides seamless power control for your projects. Trust Microchip Technology for superior products that deliver value and performance to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT, ensuring durability and long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: SINGLE

Simplified design and control for power control applications, reducing complexity and potential points of failure.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimized performance and efficiency in such scenarios.

Package Shape: RECTANGULAR

Rectangular packages are easy to mount and integrate into existing systems, providing convenience and versatility.

Nominal Turn Off Time (toff): 202 ns

Fast turn-off time allows for quick switching and control of power flow, improving efficiency and performance.

No. of Terminals: 4

Simple and straightforward connection with external circuitry, reducing installation complexity.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and heat dissipation capabilities, ensuring stable operation under high power conditions.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable performance in harsh environments and high-power applications.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating enables usage in a wide range of power control applications, offering flexibility and versatility.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high power handling capabilities and efficiency, making them a popular choice for power control applications.

Maximum Collector Current (IC): 100 A

High collector current rating allows for handling of heavy loads and high-power requirements, ensuring reliability and performance.

Terminal Position: UPPER

Upper terminal position facilitates easier connection and integration into circuit layouts, improving overall usability.

Case Connection: ISOLATED

Isolated case connection provides safety and protection against electrical interference, ensuring the reliability and stability of the IGBT.

Nominal Turn On Time (ton): 55 ns

Fast turn-on time allows for quick response and control in power switching applications, enhancing efficiency and performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT50GP60J attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

202 ns

Nominal Turn On Time (ton):

55 ns

Trade Compliance

APT50GP60J Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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