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FGH40N65UFDTU

Onsemi

FGH40N65UFDTU by Onsemi

FGH40N65UFDTU by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 80A IC, and 290W power dissipation. Ideal for power control applications, it features a built-in diode, 152ns turn-off time, and operates b/w -55 to 150°C.

Median Price

$2.594

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,285 parts In-Stock

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-

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$2.450

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$2.190

10k+ parts

$2.060

7,285

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$2.450

$2.190

$2.060

Verical

USA . 4,935 parts In-Stock

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$2.737

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$2.575

4,935

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$2.737

$2.575

Flip Electronics (Authorized)

USA . 468 parts In-Stock

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468

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Digiode

USA . 1,930 parts In-Stock

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$2.584

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1,930

$2.584

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Nova Conductors

Japan . 150 parts In-Stock

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$2.933

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$2.933

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Vyrian

USA . 3,119 parts In-Stock

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Flip Electronics

USA . 468 parts In-Stock

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468

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Chip Stock

USA . 132 parts In-Stock

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Micros

Poland . 51 parts In-Stock

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$7.915

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51

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$7.915

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Partservice

France . 45 parts In-Stock

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$7.117

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$7.117

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$7.117

45

-

$7.117

$7.117

$7.117

Micros sp.j. W. Kędra i J. Lic

Poland . 45 parts In-Stock

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-

100+ parts

$7.623

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$7.623

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$7.623

45

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$7.623

$7.623

$7.623

ComSIT Distribution GmbH

Germany . 28 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,319 parts In-Stock

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$2.448

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$2.448

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Corohmni

South Africa . 243 parts In-Stock

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$2.720

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243

$2.720

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Netroflash

USA . 2,000 parts In-Stock

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$2.933

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$2.786

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$2.728

2,000

$2.933

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$2.786

$2.728

Argo Parts USA

USA . 1,248 parts In-Stock

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$2.933

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$2.933

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Continental Prestige Electronics

USA . 326 parts In-Stock

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$2.933

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$2.874

326

$2.933

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$2.874

Ampacity Inc.

Singapore . 3,464 parts In-Stock

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$5.030

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3,464

$5.030

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Metaverse IC Inc.

Canada . 80,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,297 parts In-Stock

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RC Electronics

USA . 9,882 parts In-Stock

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$2.990

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$2.730

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$2.650

9,882

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$2.990

$2.730

$2.650

TANS Electronics

Latvia . 6,057 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,861 parts In-Stock

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Infinite Electronics LLP (Excess)

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Alle Elektronik GmbH

Germany . 3,907 parts In-Stock

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Supply Digital

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SupplyDigital Components

Austria . 2,282 parts In-Stock

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Kulean Microsystems

USA . 2,163 parts In-Stock

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Problanco Electronics

Mexico . 1,752 parts In-Stock

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Perfect Parts

USA . 1,008 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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Overview

Enhance your power control applications with the FGH40N65UFDTU from Onsemi. Crafted with precision and quality in mind, this insulated gate bipolar transistor offers unrivaled performance and reliability. From its N-channel configuration to a maximum collector-emitter voltage of 650V, this product is designed to meet your power control needs with ease. With a maximum power dissipation of 290W, this transistor delivers exceptional value and efficiency. Upgrade your system today with the FGH40N65UFDTU and experience the difference in performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the IGBT, making it suitable for various industrial applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can help improve efficiency in power control applications.

Maximum VCEsat: 2.4 V

The low VCEsat value results in minimal power loss and high efficiency during operation.

Maximum Power Dissipation (Abs): 290 W

With a high power dissipation capability, this IGBT can handle high power loads effectively.

Maximum Collector-Emitter Voltage: 650 V

The high collector-emitter voltage rating allows this IGBT to be used in applications that require high voltage operation.

Maximum Collector Current (IC): 80 A

The high collector current rating enables this IGBT to handle large current flows, making it suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N65UFDTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Fall Time (tf):

60 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

152 ns

Nominal Turn On Time (ton):

58 ns

Maximum VCEsat:

2.4 V

Trade Compliance

FGH40N65UFDTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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