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FS150R12KT3

Infineon Technologies

FS150R12KT3 by Infineon Technologies

FS150R12KT3 by Infineon Technologies is a N-CHANNEL IGBT with 6 elements in bridge configuration. It has a VCEsat of 2.15V, IC of 200A, and Pmax of 700W. Ideal for high-power applications like motor drives and inverters due to its low on/off times and high collector-emitter voltage capability.

Median Price

$114.020

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

< 1k

Distributors (Authorized)

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Mouser Electronics

USA . 17 parts In-Stock

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$114.020

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Tomark Electronics Ltd

UK . 7 parts In-Stock

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$61.330

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Digiode

USA . 473 parts In-Stock

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$152.665

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473

$152.665

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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Vyrian

USA . 22 parts In-Stock

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Rutronik

Germany . 10 parts In-Stock

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$192.510

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Nova Conductors

Japan . 10 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 9 parts In-Stock

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ECAB

Sweden . 8 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

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$0.790

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$0.790

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Modulus Dynamics

Lithuania . 5,223 parts In-Stock

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$1.520

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$1.459

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$1.398

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$1.520

$1.459

$1.398

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AZTECH Wire

Italy . 548 parts In-Stock

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$6.312

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Andel Nordic

Denmark . 96 parts In-Stock

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$45.360

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$31.750

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$31.750

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Corphita

USA . 519 parts In-Stock

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$144.630

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A-Z Elektronik GmbH

Germany . 6,195 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,130 parts In-Stock

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Argo Parts USA

USA . 4,030 parts In-Stock

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Continental Prestige Electronics

USA . 2,756 parts In-Stock

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Perfect Parts

USA . 1,326 parts In-Stock

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Kepictronics

USA . 550 parts In-Stock

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550

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Bastille Electronics

Australia . 450 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Overview

Elevate your power electronics game with the FS150R12KT3 by Infineon Technologies. As a trusted leader in the industry, Infineon delivers top-notch quality and reliability with this Insulated Gate Bipolar Transistor (IGBT) solution. Ideal for a wide range of applications, from renewable energy systems to industrial drives, this N-CHANNEL configuration offers unparalleled performance and efficiency. With built-in diode and thermistor, this 6-element bridge package provides maximum power dissipation of 700W. Say goodbye to overheating issues with its maximum operating temperature of 150°C. Experience seamless operation and optimal results with the FS150R12KT3 - the ultimate choice for your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and faster switching speeds compared to P-CHANNEL IGBTs, making them suitable for high power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor enhance the efficiency and reliability of the IGBT circuit, reducing the need for external components.

Maximum VCEsat: 2.15 V

The low VCEsat value indicates lower power losses during conduction, improving the overall efficiency of the IGBT.

Maximum Power Dissipation (Abs): 700 W

With a high power dissipation capability, this IGBT can handle large amounts of power, making it suitable for high power applications.

Maximum Collector- Emitter Voltage: 1200 V

The high maximum VCE voltage rating enables the IGBT to be utilized in high voltage applications without risking breakdown.

Maximum Collector Current (IC): 200 A

The high maximum collector current rating allows the IGBT to handle large current loads, making it suitable for high power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS150R12KT3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FS150R12KT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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