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FS150R12PT4BOSA1

Infineon Technologies

FS150R12PT4BOSA1 by Infineon Technologies

FS150R12PT4BOSA1 by Infineon is a N-CHANNEL IGBT with 6 elements in bridge configuration. It has a max voltage of 1200V, current rating of 200A, and turn off time of 600ns. Ideal for power control applications due to its high operating temperature of 175°C and built-in diode & thermistor.

Median Price

$145.270

Lifecycle Status

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19

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Arrow

USA . 4 parts In-Stock

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$57.690

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Verical

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Future Electronics

Canada . 3 parts In-Stock

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$125.160

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$119.200

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Newark

USA . 7 parts In-Stock

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$144.540

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$127.340

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Chip1Stop

Japan . 1 parts In-Stock

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$146.000

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$94.300

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Master Electronics

USA . 22 parts In-Stock

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Farnell

UK . 2 parts In-Stock

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Element14

Singapore . 2 parts In-Stock

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$246.564

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Rochester

USA . 9 parts In-Stock

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$117.050

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$104.730

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$98.570

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DigiKey

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RS (Exports)

UK . 6 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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$130.906

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Digiode

USA . 385 parts In-Stock

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$144.998

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Nova Conductors

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$233.902

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TodayComponents

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$269.920

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Vyrian

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Corohmni

South Africa . 435 parts In-Stock

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$0.715

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Modulus Dynamics

Lithuania . 2,798 parts In-Stock

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$1.206

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$1.158

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$1.110

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Aztec Data Supply Inc.

USA . 84 parts In-Stock

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$1.278

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AZTECH Wire

Italy . 591 parts In-Stock

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Component Stockers USA

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Ampacity Inc.

Singapore . 7 parts In-Stock

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Corphita

USA . 404 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

USA . 50 parts In-Stock

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Microchip USA

USA . 9,714 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Argo Parts USA

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Overview

Discover the power of Infineon Technologies with the FS150R12PT4BOSA1 Insulated Gate Bipolar Transistor. Designed for top-notch performance, reliability, and efficiency, this N-CHANNEL transistor offers unparalleled control for various power applications. With a built-in diode and thermistor, it simplifies installation and enhances functionality. Whether you're in need of precise power control or looking to optimize your system's performance, this versatile component is your go-to solution. Trust Infineon Technologies to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high switching speed and efficiency, making them ideal for power control applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor simplify the design and reduce the need for additional components, enhancing the overall reliability of the power control system.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT ensures efficient and precise control over the flow of electricity, making it essential for various industrial applications.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage, this IGBT can handle high-power applications with ease, ensuring reliable performance under demanding conditions.

Maximum Collector Current (IC): 200 A

The high maximum collector current allows this IGBT to handle large amounts of current, making it suitable for high-power applications where robustness is crucial.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS150R12PT4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X20

No. of Elements:

6

No. of Terminals:

20

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

600 ns

Nominal Turn On Time (ton):

190 ns

Trade Compliance

FS150R12PT4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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