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FS150R12KE3BOSA1

Infineon Technologies

FS150R12KE3BOSA1 by Infineon Technologies

FS150R12KE3BOSA1 by Infineon is an N-CHANNEL IGBT with 6 elements, built-in diode, and thermistor. It has a max voltage of 1200V, current of 200A, and turn-off time of 610ns. Ideal for applications requiring high power efficiency in industrial settings due to its isolated case connection and fast switching capabilities.

Median Price

$133.911

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 21 parts In-Stock

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$106.440

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$106.440

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DigiKey

USA . 19 parts In-Stock

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$123.170

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19

$123.170

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Newark

USA . 22 parts In-Stock

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$129.230

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22

$129.230

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Arrow

USA . 250 parts In-Stock

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$138.592

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250

$138.592

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Element14

Singapore . 21 parts In-Stock

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$181.390

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21

$181.390

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Verical

USA . 10 parts In-Stock

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$225.760

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10

$225.760

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Chip1Stop

Japan . 10 parts In-Stock

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$231.000

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10

$231.000

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Future Electronics

Canada . 10 parts In-Stock

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$103.730

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10

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$103.730

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Distributors (In-Stock)

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Digiode

USA . 807 parts In-Stock

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$104.604

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807

$104.604

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TodayComponents

USA . 100 parts In-Stock

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$175.100

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$158.270

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100

$175.100

$158.270

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Nova Conductors

Japan . 100 parts In-Stock

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$314.660

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100

$314.660

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NAC Semi

USA . 10 parts In-Stock

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$374.020

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$374.020

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Vyrian

USA . 2,630 parts In-Stock

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2,630

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IBS Electronics

USA . 10 parts In-Stock

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$143.953

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 973 parts In-Stock

1+ parts

$0.633

100+ parts

$0.608

1k+ parts

$0.582

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973

$0.633

$0.608

$0.582

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Aztec Data Supply Inc.

USA . 137 parts In-Stock

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$1.456

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$1.456

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Corohmni

South Africa . 844 parts In-Stock

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$1.728

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$1.728

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AZTECH Wire

Italy . 711 parts In-Stock

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$12.365

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711

$12.365

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Semicontronic

India . 96 parts In-Stock

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$79.630

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$77.639

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$77.241

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96

$79.630

$77.639

$77.241

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Ampacity Inc.

Singapore . 83 parts In-Stock

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$79.630

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$79.630

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Corphita

USA . 46 parts In-Stock

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$99.099

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Continental Prestige Electronics

USA . 84 parts In-Stock

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$261.810

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$261.810

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Netroflash

USA . 100 parts In-Stock

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$314.660

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100

$314.660

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Microchip USA

USA . 7,131 parts In-Stock

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$472.050

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$472.050

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Argo Parts USA

USA . 1,421 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Elevate your power control solutions with the FS150R12KE3BOSA1 by Infineon Technologies. Designed with precision and expertise, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled performance and reliability for a wide range of applications. With its N-CHANNEL configuration and 6-element design, this product provides superior efficiency and durability. Whether you're looking to enhance your industrial equipment or streamline your renewable energy systems, this IGBT delivers the value and benefits you need to stay ahead in today's competitive market. Experience the difference with the FS150R12KE3BOSA1 and power up your projects like never before.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and faster switching speeds compared to P-channel, making them a good choice for high efficiency applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor help improve efficiency and reliability in bridge configurations, making this IGBT suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular packages are easy to mount and provide good thermal characteristics, ensuring efficient heat dissipation in operation.

Nominal Turn Off Time (toff): 610 ns

The fast turn-off time of 610 ns enhances the switching speed of the IGBT, reducing switching losses and improving overall efficiency.

Maximum Collector-Emitter Voltage: 1200 V

With a high collector-emitter voltage rating of 1200 V, this IGBT is suitable for high voltage applications where robust performance is required.

Maximum Collector Current (IC): 200 A

The high collector current rating of 200 A allows this IGBT to handle substantial power levels, making it ideal for high-power applications.

Nominal Turn On Time (ton): 340 ns

The fast turn-on time of 340 ns contributes to efficient switching operations, reducing power losses and enhancing the overall performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS150R12KE3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Trade Compliance

FS150R12KE3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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