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IRGP20B60PDPBF

Infineon Technologies

IRGP20B60PDPBF by Infineon Technologies

IRGP20B60PDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Collector Current of 40A. It is designed for POWER CONTROL applications, featuring a Nominal Turn Off Time of 138ns and Max Power Dissipation of 220W.

Median Price

$8.518

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.201

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-

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150

$3.201

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Voyager Components

USA . 398 parts In-Stock

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$13.836

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398

$13.836

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Chip Stock

USA . 4,000 parts In-Stock

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4,000

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Vyrian

USA . 840 parts In-Stock

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840

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Digiode

USA . 599 parts In-Stock

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599

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ComSIT Distribution GmbH

Germany . 15 parts In-Stock

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15

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Distributors (Availability)

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.246

100+ parts

$1.134

1k+ parts

$1.022

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-

350

$1.246

$1.134

$1.022

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Aztec Data Supply Inc.

USA . 3,482 parts In-Stock

1+ parts

$1.470

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3,482

$1.470

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Modulus Dynamics

Lithuania . 19,566 parts In-Stock

1+ parts

$2.752

100+ parts

$2.642

1k+ parts

$2.532

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19,566

$2.752

$2.642

$2.532

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Corohmni

South Africa . 1,050 parts In-Stock

1+ parts

$2.752

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1,050

$2.752

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Continental Prestige Electronics

USA . 4,441 parts In-Stock

1+ parts

$3.201

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$3.136

4,441

$3.201

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$3.136

Argo Parts USA

USA . 569 parts In-Stock

1+ parts

$3.201

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569

$3.201

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Component Stockers USA

USA . 3,161 parts In-Stock

1+ parts

$9.720

100+ parts

$9.230

1k+ parts

$8.940

10k+ parts

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3,161

$9.720

$9.230

$8.940

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Ampacity Inc.

Singapore . 1,132 parts In-Stock

1+ parts

$12.050

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$12.050

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Microchip USA

USA . 6,357 parts In-Stock

1+ parts

$15.015

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6,357

$15.015

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AZTECH Wire

Italy . 524 parts In-Stock

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$18.527

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524

$18.527

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Semicontronic

India . 1,562 parts In-Stock

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$31.050

100+ parts

$30.274

1k+ parts

$30.118

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1,562

$31.050

$30.274

$30.118

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RC Electronics

USA . 13,836 parts In-Stock

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$3.370

1k+ parts

$3.180

10k+ parts

$3.120

13,836

-

$3.370

$3.180

$3.120

Perfect Parts

USA . 7,672 parts In-Stock

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7,672

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A-Z Elektronik GmbH

Germany . 6,110 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,073 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$3.136

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$3.040

10k+ parts

$2.976

1,000

-

$3.136

$3.040

$2.976

Corphita

USA . 38 parts In-Stock

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Assy Fe

Spain . 32 parts In-Stock

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Overview

Discover the unparalleled power and efficiency of the IRGP20B60PDPBF by Infineon Technologies, a leading manufacturer in the electronics industry. This Insulated Gate Bipolar Transistor (IGBT) offers seamless power control with a single configuration and built-in diode, making it perfect for various applications. Experience the benefits of fast rise and fall times, high power dissipation, and a wide operating temperature range. Trust in the quality and reliability of Infineon Technologies as you enhance your power electronics with this innovative product. Elevate your projects with the IRGP20B60PDPBF and unlock new possibilities in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by having a built-in diode for reverse current flow protection.

Maximum Rise Time (tr): 8 ns

Enables fast switching speeds for quick power control applications.

Package Shape: RECTANGULAR

Facilitates easy and secure mounting of the IGBT in electronic circuits.

Maximum Power Dissipation (Abs): 220 W

Handles high power levels efficiently, suitable for demanding power control applications.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, ensuring reliable performance in various environments.

Maximum Collector-Emitter Voltage: 600 V

Handles high voltage levels, making it suitable for power control applications.

Maximum Collector Current (IC): 40 A

Supports high current levels for power control operations.

Maximum Gate-Emitter Threshold Voltage: 5 V

Allows for precise control of the IGBT's switching behavior.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGP20B60PDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY, LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

17 ns

Maximum Gate-Emitter Threshold Voltage:

5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

8 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

138 ns

Nominal Turn On Time (ton):

25 ns

Trade Compliance

IRGP20B60PDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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