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FF600R12KE4EBOSA1

Infineon Technologies

FF600R12KE4EBOSA1 by Infineon Technologies

FF600R12KE4EBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 elements, built-in diode, and a max voltage of 1200V. It has a turn-off time of 630ns and turn-on time of 232ns, making it ideal for power control applications. This UL approved transistor operates from -40°C with a common emitter configuration in a rectangular package style.

Median Price

$153.963

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 11 parts In-Stock

1+ parts

$84.100

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11

$84.100

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Rochester

USA . 57 parts In-Stock

1+ parts

$131.030

100+ parts

$123.170

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$115.310

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57

$131.030

$123.170

$115.310

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Farnell

UK . 9 parts In-Stock

1+ parts

$144.090

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9

$144.090

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DigiKey

USA . 10 parts In-Stock

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$153.040

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10

$153.040

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Mouser Electronics

USA . 18 parts In-Stock

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$156.480

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18

$156.480

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Chip1Stop

Japan . 10 parts In-Stock

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$242.000

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10

$242.000

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Element14

Singapore . 14 parts In-Stock

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$385.790

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14

$385.790

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Verical

USA . 50 parts In-Stock

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$153.963

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$144.137

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50

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$153.963

$144.137

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RS (Exports)

UK . 2 parts In-Stock

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$283.816

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2

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$283.816

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Distributors (In-Stock)

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Digiode

USA . 419 parts In-Stock

1+ parts

$79.895

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419

$79.895

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Nova Conductors

Japan . 300 parts In-Stock

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$288.825

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$288.825

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Vyrian

USA . 2,961 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 334 parts In-Stock

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$9.594

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334

$9.594

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Ampacity Inc.

Singapore . 14 parts In-Stock

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$71.480

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14

$71.480

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Corphita

USA . 570 parts In-Stock

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$75.690

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570

$75.690

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Allen Electronics Distributors

USA . 2 parts In-Stock

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$202.030

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$229.970

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$202.030

$229.970

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Modulus Dynamics

Lithuania . 6,878 parts In-Stock

1+ parts

$213.039

100+ parts

$204.517

1k+ parts

$195.996

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6,878

$213.039

$204.517

$195.996

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Continental Prestige Electronics

USA . 10 parts In-Stock

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$261.430

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10

$261.430

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Netroflash

USA . 2,000 parts In-Stock

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$288.825

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$274.384

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$268.607

2,000

$288.825

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$274.384

$268.607

Microchip USA

USA . 3,772 parts In-Stock

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$484.260

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3,772

$484.260

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 639 parts In-Stock

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Unleash the power of cutting-edge technology with the FF600R12KE4EBOSA1 by Infineon Technologies, a leader in the industry. This Insulated Gate Bipolar Transistor (IGBT) offers unmatched performance and reliability for power control applications. With its N-CHANNEL polarity, COMMON EMITTER configuration, and 2 elements with built-in diode, this transistor is designed to meet your highest expectations. From its UL Approved reference standard to its maximum Collector-Emitter Voltage of 1200V, this product delivers exceptional value and benefits to customers. Upgrade your systems today with the FF600R12KE4EBOSA1 and experience the difference quality can make.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Allows for efficient power control in various applications.

Configuration:

COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN DIODE - Provides enhanced functionality and versatility in power control.

Transistor Application:

POWER CONTROL - Ideal for regulating and managing power in a wide range of electronic devices.

Package Shape:

RECTANGULAR - Enables easy integration and installation in different electronic systems.

No. of Elements:

2 - Offers dual functionality for more complex power control requirements.

Nominal Turn Off Time (toff):

630 ns - Ensures quick response time in turning off power to prevent damage.

No. of Terminals:

7 - Provides multiple connecting points for better circuit design flexibility.

Package Style (Meter):

FLANGE MOUNT - Allows for secure and stable mounting in various applications.

Maximum Collector-Emitter Voltage:

1200 V - Suitable for high-voltage applications requiring reliable power control.

Transistor Element Material:

SILICON - Provides high durability and efficiency in power management.

Minimum Operating Temperature:

40 °C - Can operate in extreme temperature conditions without performance issues.

Terminal Position:

UPPER - Facilitates easy access and connection during installation.

Case Connection:

ISOLATED - Enhances safety by isolating the case from the circuit.

Nominal Turn On Time (ton):

232 ns - Enables quick activation of power for efficient operation.

Reference Standard:

UL APPROVED - Meets industry standards for quality and safety assurance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF600R12KE4EBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

630 ns

Nominal Turn On Time (ton):

232 ns

Trade Compliance

FF600R12KE4EBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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