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FF600R12KE4BOSA1

Infineon Technologies

FF600R12KE4BOSA1 by Infineon Technologies

FF600R12KE4BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has a max voltage of 1200V and a turn off time of 630ns, making it ideal for POWER CONTROL applications. This UL APPROVED transistor operates in temperatures as low as -40°C and comes in a FLANGE MOUNT package style.

Median Price

$153.963

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Rochester

USA . 8 parts In-Stock

1+ parts

$131.030

100+ parts

$123.170

1k+ parts

$115.310

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8

$131.030

$123.170

$115.310

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Farnell

UK . 7 parts In-Stock

1+ parts

$152.470

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$152.470

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DigiKey

USA . 71 parts In-Stock

1+ parts

$153.040

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71

$153.040

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Mouser Electronics

USA . 12 parts In-Stock

1+ parts

$156.480

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12

$156.480

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Element14

Singapore . 18 parts In-Stock

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$229.011

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$229.011

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Chip1Stop

Japan . 6 parts In-Stock

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$230.000

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RS (Exports)

UK . 20 parts In-Stock

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Verical

USA . 8 parts In-Stock

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$153.963

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$144.137

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8

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$153.963

$144.137

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Distributors (In-Stock)

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Digiode

USA . 334 parts In-Stock

1+ parts

$119.824

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334

$119.824

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Nova Conductors

Japan . 300 parts In-Stock

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$309.979

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$309.979

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Vyrian

USA . 3,126 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 395 parts In-Stock

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$9.359

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395

$9.359

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Semicontronic

India . 16 parts In-Stock

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$107.210

100+ parts

$104.530

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$103.994

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16

$107.210

$104.530

$103.994

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Ampacity Inc.

Singapore . 9 parts In-Stock

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$107.210

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$107.210

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Corphita

USA . 193 parts In-Stock

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$113.517

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Modulus Dynamics

Lithuania . 10,426 parts In-Stock

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$233.885

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$224.530

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$215.174

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$215.174

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Corohmni

South Africa . 146 parts In-Stock

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$233.885

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Continental Prestige Electronics

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$253.460

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Microchip USA

USA . 9,724 parts In-Stock

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$470.535

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Argo Parts USA

USA . 3,238 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$303.780

1k+ parts

$294.481

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$288.281

1,000

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$303.780

$294.481

$288.281

Perfect Parts

USA . 11 parts In-Stock

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Overview

Experience superior power control with the FF600R12KE4BOSA1 from Infineon Technologies, a leading manufacturer known for high-quality Insulated Gate Bipolar Transistors. This N-CHANNEL transistor boasts a series connected configuration with built-in diodes, making it ideal for a wide range of applications. With a maximum collector-emitter voltage of 1200V and fast turn-on/off times, this transistor offers unmatched performance and reliability. Trust Infineon Technologies to deliver cutting-edge technology that meets your power control needs with precision and efficiency.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher switching speeds compared to P-channel IGBTs, making them an efficient choice for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for better voltage and current sharing between the two elements, enhancing the overall performance and reliability of the IGBT.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for switching high power loads efficiently.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and heat dissipation, making it suitable for industrial applications where space is a constraint.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT can withstand higher voltage levels, making it ideal for high-power applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables this IGBT to perform reliably in harsh environmental conditions, ensuring continuous operation in extreme temperatures.

Nominal Turn On Time: 232 ns

The fast turn-on time of this IGBT enables quick switching speeds, reducing power losses and improving overall efficiency in power control applications.

Reference Standard: UL APPROVED

The UL approval ensures that this IGBT meets safety and performance standards, providing confidence in its reliability and quality.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF600R12KE4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

630 ns

Nominal Turn On Time (ton):

232 ns

Trade Compliance

FF600R12KE4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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