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FF600R12IE4BOSA1

Infineon Technologies

FF600R12IE4BOSA1 by Infineon Technologies

FF600R12IE4BOSA1 by Infineon is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has a Max VCEsat of 2.05V and can handle up to 600A of Collector Current. Ideal for POWER CONTROL applications, it operates at a max temperature of 175°C, making it suitable for high-power systems.

Median Price

$357.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

1+ parts

$318.030

100+ parts

-

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3

$318.030

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Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$357.000

100+ parts

-

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3

$357.000

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Verical

USA . 3 parts In-Stock

1+ parts

$407.500

100+ parts

$407.500

1k+ parts

$407.500

10k+ parts

$407.500

3

$407.500

$407.500

$407.500

$407.500

RS (Exports)

UK . 3 parts In-Stock

1+ parts

-

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-

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3

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Distributors (In-Stock)

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Digiode

USA . 497 parts In-Stock

1+ parts

$342.000

100+ parts

-

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497

$342.000

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Nova Conductors

Japan . 400 parts In-Stock

1+ parts

$485.000

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400

$485.000

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$566.900

100+ parts

$512.440

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100

$566.900

$512.440

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Vyrian

USA . 5,884 parts In-Stock

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5,884

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 16,245 parts In-Stock

1+ parts

$0.310

100+ parts

$0.298

1k+ parts

$0.285

10k+ parts

-

16,245

$0.310

$0.298

$0.285

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Corohmni

South Africa . 136 parts In-Stock

1+ parts

$1.518

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136

$1.518

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AZTECH Wire

Italy . 637 parts In-Stock

1+ parts

$8.361

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637

$8.361

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$248.200

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3

$248.200

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Corphita

USA . 140 parts In-Stock

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$324.000

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140

$324.000

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Continental Prestige Electronics

USA . 6,462 parts In-Stock

1+ parts

$485.000

100+ parts

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10k+ parts

$475.300

6,462

$485.000

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$475.300

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$485.000

100+ parts

-

1k+ parts

$460.750

10k+ parts

$451.050

1,000

$485.000

-

$460.750

$451.050

Argo Parts USA

USA . 185 parts In-Stock

1+ parts

$485.000

100+ parts

$480.150

1k+ parts

$475.300

10k+ parts

$470.450

185

$485.000

$480.150

$475.300

$470.450

Overview

Unleash the power of innovation with the FF600R12IE4BOSA1 from Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. With its N-channel configuration and series connected elements, this product offers unmatched performance and reliability. Experience the benefits of fast turn-on and turn-off times, coupled with high power dissipation capabilities. Trust Infineon Technologies to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for improved power distribution and thermal management, ensuring reliable performance under high power conditions.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers precise control over power output for various systems and devices.

Maximum VCEsat: 2.05 V

With a low saturation voltage, this IGBT can help minimize power losses and improve overall efficiency in power control circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into existing electronic systems.

Nominal Turn Off Time (toff): 1020 ns

The fast turn-off time ensures quick switching speeds, reducing the risk of overheating and improving system reliability.

Maximum Power Dissipation (Abs): 3350 W

With a high power dissipation capability, this IGBT can handle large power loads without overheating or failure.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure and stable mounting options, perfect for industrial applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand harsh environmental conditions and maintain stable performance.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating allows this IGBT to be used in high voltage applications, providing greater flexibility and compatibility.

Transistor Element Material: SILICON

Silicon-based transistor elements offer superior performance and reliability compared to other materials, ensuring long-term stability and efficiency.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating provides robust protection against voltage spikes and surges, enhancing the overall durability of the IGBT.

Maximum Collector Current (IC): 600 A

With a high collector current rating, this IGBT can handle large current loads with ease, making it suitable for high-power applications.

Terminal Position: UPPER

The upper terminal position allows for convenient and organized cable connections, simplifying installation and maintenance procedures.

Case Connection: ISOLATED

The isolated case connection helps prevent electric shock hazards and interference, ensuring safe and reliable operation in various environments.

Nominal Turn On Time (ton): 410 ns

The fast turn-on time enables quick response and precise control over power output, essential for applications requiring rapid switching speeds.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF600R12IE4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1020 ns

Nominal Turn On Time (ton):

410 ns

Maximum VCEsat:

2.05 V

Trade Compliance

FF600R12IE4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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