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FF600R12ME4AB11BOSA1

Infineon Technologies

FF600R12ME4AB11BOSA1 by Infineon Technologies

Infineon Technologies' FF600R12ME4AB11BOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, ideal for POWER CONTROL applications. Featuring a Max VCEsat of 2.1V and Max Collector-Emitter Voltage of 1200V, it offers high power dissipation up to 3350W. With fast turn-off time (toff) of 620ns and turn-on time (ton) of 230ns, this UL RECOGNIZED transistor operates b/w -40°C to 150°C efficiently.

Median Price

$262.600

Lifecycle Status

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9

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1k+

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Rochester

USA . 161 parts In-Stock

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$233.390

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$219.390

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$205.380

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Newark

USA . 6 parts In-Stock

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$262.600

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$240.450

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$240.450

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Verical

USA . 161 parts In-Stock

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$274.238

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$256.725

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DigiKey

USA . 6 parts In-Stock

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Digiode

USA . 236 parts In-Stock

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$232.256

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Nova Conductors

Japan . 300 parts In-Stock

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$302.438

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Vyrian

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Aztec Data Supply Inc.

USA . 2,509 parts In-Stock

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$0.410

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2,509

$0.410

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.640

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$0.582

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$0.525

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$0.640

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Corohmni

South Africa . 308 parts In-Stock

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$1.502

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Modulus Dynamics

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$1.601

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$1.537

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$1.473

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AZTECH Wire

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$23.490

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Corphita

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Argo Parts USA

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Bastille Electronics

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Overview

Unleash the power of cutting-edge technology with the FF600R12ME4AB11BOSA1 from Infineon Technologies. As a leader in the industry, Infineon delivers unparalleled quality and precision with their Insulated Gate Bipolar Transistors (IGBT). Designed for power control applications, this N-CHANNEL transistor boasts a maximum collector-emitter voltage of 1200V and a maximum collector current of 950A. With its series connected configuration and built-in diode and thermistor, this transistor offers exceptional performance and reliability. Experience the value and benefits of Infineon's FF600R12ME4AB11BOSA1 for your next project.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have better performance and efficiency compared to P-CHANNEL IGBTs, making this product a good choice for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for better control and efficiency in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, ensuring optimal performance in such applications.

Maximum VCEsat: 2.1 V

Low VCEsat value indicates lower energy losses and higher efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular packages are typically easier to mount and handle, providing convenience in installation.

Nominal Turn Off Time (toff): 620 ns

Fast turn-off time allows for precise control and reduces switching losses in power control applications.

Maximum Power Dissipation (Abs): 3350 W

High power dissipation capability allows the IGBT to handle high power loads effectively.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures stable performance even in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High breakdown voltage rating provides reliability and protection against voltage spikes in power applications.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Low gate-emitter threshold voltage allows for efficient switching and control of the IGBT.

Nominal Turn On Time (ton): 230 ns

Fast turn-on time contributes to efficient power switching and control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF600R12ME4AB11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

620 ns

Nominal Turn On Time (ton):

230 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FF600R12ME4AB11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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