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IRGP50B60PDPBF

Infineon Technologies

IRGP50B60PDPBF by Infineon Technologies

IRGP50B60PDPBF by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 370W power dissipation, and 75A max collector current. Ideal for power control applications, it features a single configuration with built-in diode in a rectangular package shape. Operating at up to 150°C, it offers fast rise time of 36ns and fall time of 65ns.

Median Price

$9.241

Lifecycle Status

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8

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1k+

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Nova Conductors

Japan . 32 parts In-Stock

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$4.490

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$4.490

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Voyager Components

USA . 25 parts In-Stock

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$13.993

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25

$13.993

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Chip Stock

USA . 690 parts In-Stock

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690

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Digiode

USA . 660 parts In-Stock

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660

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Vyrian

USA . 294 parts In-Stock

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Inventory MP

USA . 13 parts In-Stock

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Bristol Electronics

USA . 13 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,849 parts In-Stock

1+ parts

$0.330

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2,849

$0.330

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Modulus Dynamics

Lithuania . 12,179 parts In-Stock

1+ parts

$0.466

100+ parts

$0.447

1k+ parts

$0.429

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-

12,179

$0.466

$0.447

$0.429

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$0.631

100+ parts

$0.574

1k+ parts

$0.517

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70

$0.631

$0.574

$0.517

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Corohmni

South Africa . 511 parts In-Stock

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$1.944

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511

$1.944

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Continental Prestige Electronics

USA . 5,162 parts In-Stock

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$2.952

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$2.893

5,162

$2.952

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$2.893

Argo Parts USA

USA . 18 parts In-Stock

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$2.952

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18

$2.952

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Component Stockers USA

USA . 2,813 parts In-Stock

1+ parts

$3.910

100+ parts

$3.720

1k+ parts

$3.600

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2,813

$3.910

$3.720

$3.600

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Netroflash

USA . 1,000 parts In-Stock

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$4.490

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$4.490

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Ampacity Inc.

Singapore . 755 parts In-Stock

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$6.050

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755

$6.050

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AZTECH Wire

Italy . 764 parts In-Stock

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$6.815

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764

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Andel Nordic

Denmark . 459 parts In-Stock

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$30.330

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$21.229

10k+ parts

$21.229

459

$30.330

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$21.229

$21.229

Semicontronic

India . 1,348 parts In-Stock

1+ parts

$39.050

100+ parts

$38.074

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$37.878

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Perfect Parts

USA . 7,085 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,895 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,930 parts In-Stock

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S.R.D Solutions

India . 2,200 parts In-Stock

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Corphita

USA . 964 parts In-Stock

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Kepictronics

USA . 416 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$3.079

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$3.079

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$3.079

100

-

$3.079

$3.079

$3.079

Lucentia Tech

USA . 100 parts In-Stock

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$3.079

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$3.079

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$3.079

100

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$3.079

$3.079

$3.079

Overview

Upgrade your power control systems with the IRGP50B60PDPBF Insulated Gate Bipolar Transistor from Infineon Technologies. With a maximum operating temperature of 150°C and a collector-emitter voltage of 600V, this N-channel transistor offers exceptional performance for a wide range of applications. Its single configuration with built-in diode ensures ease of installation, while its high power dissipation capacity of 370W guarantees reliable operation. Trust in the quality and expertise of Infineon Technologies to bring you cutting-edge technology that delivers superior efficiency and performance. Elevate your power control solutions with the IRGP50B60PDPBF today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the IGBT resistant to physical damage and environmental factors.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with an integrated diode, reducing the need for additional components and saving space in the circuit.

Transistor Application: POWER CONTROL

Designed for efficient and reliable power control applications, ensuring optimal performance in power management systems.

Maximum Power Dissipation (Abs): 370 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating, ensuring stable operation under heavy loads.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments, providing reliability in various industrial applications.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating allows for use in high voltage circuits, making it suitable for a wide range of applications.

Maximum Collector Current (IC): 75 A

Capable of handling high currents, making it suitable for power control systems requiring high current switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGP50B60PDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY, LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

65 ns

Maximum Gate-Emitter Threshold Voltage:

5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

36 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

190 ns

Nominal Turn On Time (ton):

59 ns

Trade Compliance

IRGP50B60PDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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