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IKW40N120T2XK

Infineon Technologies

IKW40N120T2XK by Infineon Technologies

IKW40N120T2XK by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 75A. It is commonly used for power control applications due to its fast nominal turn on time of 60ns and built-in diode.

Median Price

$7.198

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$7.198

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Vyrian

USA . 1,235 parts In-Stock

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Digiode

USA . 894 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,571 parts In-Stock

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$0.950

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Modulus Dynamics

Lithuania . 525 parts In-Stock

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$6.509

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$6.249

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$5.988

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525

$6.509

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Corohmni

South Africa . 146 parts In-Stock

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$6.509

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Continental Prestige Electronics

USA . 156 parts In-Stock

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$7.198

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$7.054

156

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Netroflash

USA . 50 parts In-Stock

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$7.198

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Semicontronic

India . 1,068 parts In-Stock

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$10.050

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$9.799

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$9.748

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$9.748

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AZTECH Wire

Italy . 599 parts In-Stock

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$11.900

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Ampacity Inc.

Singapore . 656 parts In-Stock

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$47.050

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Corphita

USA . 994 parts In-Stock

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Argo Parts USA

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Overview

Experience unmatched power control with the IKW40N120T2XK by Infineon Technologies. As a leader in the industry, Infineon brings you top-quality insulated gate bipolar transistors (IGBT) that are built to last. This N-channel transistor offers a single configuration with a built-in diode, making it perfect for a wide range of power control applications. With its plastic/epoxy package body material and through-hole terminal form, this IGBT ensures easy installation and reliable performance. Whether you're looking to optimize energy efficiency or enhance motor control systems, the IKW40N120T2XK delivers exceptional value, benefits, and advantages to meet all your needs. Trust in Infineon for superior technology that never compromises on quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring reliability and durability of the device.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for efficient freewheeling of currents, reducing power loss and improving overall performance.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers high current and voltage handling capabilities.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into electronic systems, saving space and improving overall design efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, reducing resistance and improving heat dissipation for better performance.

Nominal Turn Off Time (toff): 600 ns

The fast turn-off time ensures quick control over the power flow, reducing switching losses and improving efficiency.

No. of Terminals: 3

Having three terminals allows for easy connections and provides versatile options for different circuit designs.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure mounting and heat dissipation, ensuring stable operation even under high-power conditions.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand harsh environmental conditions and continue to operate reliably.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating allows for handling of high-power applications, making this IGBT suitable for a wide range of industrial uses.

Transistor Element Material: SILICON

Silicon is a common and reliable material for semiconductor devices, providing good electrical properties and long-term stability.

Maximum Collector Current (IC): 75 A

With a high maximum collector current rating, this IGBT can handle large amounts of current without overheating or performance degradation.

Terminal Position: SINGLE

Single terminal position simplifies the wiring process and reduces the chances of wiring errors, improving overall system reliability.

Case Connection: COLLECTOR

The collector connection is the primary power connection for the IGBT, ensuring efficient power flow and minimal resistance for improved performance.

Nominal Turn On Time (ton): 60 ns

The fast turn-on time allows for quick response to control signals, enabling precise power control and efficient operation in dynamic systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW40N120T2XK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

600 ns

Nominal Turn On Time (ton):

60 ns

Trade Compliance

IKW40N120T2XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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