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IKW40N65H5AXKSA1

Infineon Technologies

IKW40N65H5AXKSA1 by Infineon Technologies

IKW40N65H5AXKSA1 by Infineon is an N-CHANNEL IGBT with VCEsat of 2.1V, IC of 74A, and Pmax of 250W. Ideal for POWER CONTROL applications, it has a toff of 204ns and ton of 32ns. Operating b/w -40 to 175°C, it features a VCE(max) of 650V and VGE(th) of 4.8V.

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Vyrian

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Digiode

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Modulus Dynamics

Lithuania . 4,918 parts In-Stock

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$1.908

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$1.829

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AZTECH Wire

Italy . 372 parts In-Stock

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Ampacity Inc.

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Overview

Unleash the power of innovation with the IKW40N65H5AXKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). This single-channel transistor with a built-in diode is perfect for power control applications, offering a maximum operating temperature of 175°C and a collector-emitter voltage of 650V. Say goodbye to inefficiency and hello to optimized performance with this high-power solution. Elevate your projects with Infineon Technologies' IKW40N65H5AXKSA1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state resistance, allowing for efficient power control and reduced power dissipation.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the transistor from voltage spikes and reverse current, improving overall reliability.

Transistor Application: POWER CONTROL

This IGBT is specifically designed for power control applications, ensuring efficient and precise control over power output.

Maximum VCEsat: 2.1 V

The low VCEsat minimizes power losses and improves efficiency in high power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation in various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, minimizing the risk of disconnection or breakage.

Nominal Turn Off Time (toff): 204 ns

The fast turn-off time helps in quickly switching off the transistor, improving response time and reducing power losses.

Maximum Power Dissipation (Abs): 250 W

With a high power dissipation rating, this IGBT can handle high-power applications without the risk of overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for secure mounting onto a heatsink, improving heat dissipation and overall performance.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this IGBT can withstand extreme temperature conditions without performance degradation.

Maximum Collector-Emitter Voltage: 650 V

The high collector-emitter voltage rating allows the IGBT to handle high voltage applications safely and efficiently.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability and high performance, making this IGBT a robust choice for power control applications.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating ensures stable and precise control over the switching operation of the IGBT.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IGBT can function effectively in cold environments without any issues.

Maximum Collector Current (IC): 74 A

The high collector current rating allows the IGBT to handle large current flows without the risk of damage or overheating.

Maximum Gate-Emitter Threshold Voltage: 4.8 V

The gate-emitter threshold voltage ensures reliable and stable operation of the IGBT in power control applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and makes connections easier to manage.

Case Connection: COLLECTOR

The case connection to the collector helps improve thermal management, ensuring better heat dissipation and overall performance.

Nominal Turn On Time (ton): 32 ns

The fast turn-on time enhances the response time of the IGBT, allowing for quick and efficient power switching.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 standard, this IGBT meets stringent automotive requirements for quality and reliability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW40N65H5AXKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

4.8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

204 ns

Nominal Turn On Time (ton):

32 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IKW40N65H5AXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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