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FD200R12KE3PHOSA1

Infineon Technologies

FD200R12KE3PHOSA1 by Infineon Technologies

Infineon's FD200R12KE3PHOSA1 is an N-CHANNEL IGBT with 1200V max collector-emitter voltage. It has a single configuration with built-in diode, ideal for power control applications. Featuring 830ns turn off time and 400ns turn on time, this UL recognized transistor operates from -40°C and comes in a flange mount package style.

Median Price

$183.505

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$183.505

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Vyrian

USA . 3,306 parts In-Stock

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Digiode

USA . 217 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,863 parts In-Stock

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$1.712

100+ parts

$1.644

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$1.575

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3,863

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.998

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$1.978

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$1.898

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100

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Ampacity Inc.

Singapore . 640 parts In-Stock

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$6.050

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AZTECH Wire

Italy . 883 parts In-Stock

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$6.077

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Aranea Global

USA . 100 parts In-Stock

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$179.835

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$172.642

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Continental Prestige Electronics

USA . 1,499 parts In-Stock

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$183.505

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$179.835

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Microchip USA

USA . 5,332 parts In-Stock

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Argo Parts USA

USA . 3,972 parts In-Stock

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Corphita

USA . 23 parts In-Stock

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Overview

Enhance your power control applications with the FD200R12KE3PHOSA1 Insulated Gate Bipolar Transistor by Infineon Technologies. Known for their superior quality and reliability, Infineon Technologies is a leading manufacturer in the industry. This N-CHANNEL transistor with built-in diode offers unmatched performance and efficiency. With a maximum collector-emitter voltage of 1200V and a nominal turn off time of 830ns, this product ensures optimal power control. Whether you're looking to improve energy efficiency or enhance overall performance, the FD200R12KE3PHOSA1 is the perfect solution for your needs. Elevate your projects with this high-quality IGBT from Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically provide lower conduction losses and higher efficiency, making them a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and reduces the need for additional components, making this IGBT more convenient to use.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance and efficient operation in controlling high power loads.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum voltage rating allows this IGBT to withstand high voltage levels, making it suitable for a wide range of power control applications.

Nominal Turn Off Time (toff): 830 ns

The fast turn-off time helps minimize switching losses and improve efficiency, making this IGBT ideal for applications requiring fast switching speeds.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD200R12KE3PHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

830 ns

Nominal Turn On Time (ton):

400 ns

Trade Compliance

FD200R12KE3PHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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