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FD200R12KE3HOSA1

Infineon Technologies

FD200R12KE3HOSA1 by Infineon Technologies

Infineon's FD200R12KE3HOSA1 is an N-CHANNEL IGBT with 1200V max collector-emitter voltage and 295A max collector current. It has a single configuration with built-in diode, 830ns turn off time, and 400ns turn on time. Ideal for high-power applications requiring fast switching such as industrial motor drives and renewable energy systems.

Median Price

$107.754

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4 parts In-Stock

1+ parts

$105.000

100+ parts

-

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4

$105.000

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DigiKey

USA . 4 parts In-Stock

1+ parts

$107.440

100+ parts

-

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4

$107.440

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Verical

USA . 4 parts In-Stock

1+ parts

$108.069

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4

$108.069

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Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$127.880

100+ parts

$114.010

1k+ parts

$114.010

10k+ parts

$114.010

3

$127.880

$114.010

$114.010

$114.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 971 parts In-Stock

1+ parts

$91.295

100+ parts

-

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971

$91.295

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$145.367

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50

$145.367

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$162.770

100+ parts

$147.130

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100

$162.770

$147.130

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Vyrian

USA . 5,373 parts In-Stock

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5,373

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 16,086 parts In-Stock

1+ parts

$0.517

100+ parts

$0.496

1k+ parts

$0.476

10k+ parts

-

16,086

$0.517

$0.496

$0.476

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Aztec Data Supply Inc.

USA . 195 parts In-Stock

1+ parts

$1.441

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195

$1.441

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Corohmni

South Africa . 74 parts In-Stock

1+ parts

$1.719

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74

$1.719

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.339

100+ parts

$2.128

1k+ parts

$1.918

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-

3,000

$2.339

$2.128

$1.918

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AZTECH Wire

Italy . 310 parts In-Stock

1+ parts

$10.412

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310

$10.412

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Corphita

USA . 1 parts In-Stock

1+ parts

$86.490

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1

$86.490

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Ampacity Inc.

Singapore . 9 parts In-Stock

1+ parts

$90.100

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9

$90.100

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Component Stockers USA

USA . 17 parts In-Stock

1+ parts

$124.760

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17

$124.760

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Continental Prestige Electronics

USA . 2,557 parts In-Stock

1+ parts

$145.367

100+ parts

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10k+ parts

$142.460

2,557

$145.367

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-

$142.460

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$145.400

100+ parts

$138.130

1k+ parts

-

10k+ parts

$129.406

300

$145.400

$138.130

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$129.406

Microchip USA

USA . 135 parts In-Stock

1+ parts

$224.460

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135

$224.460

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Argo Parts USA

USA . 1,725 parts In-Stock

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1,725

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Overview

Upgrade your power electronics with the FD200R12KE3HOSA1 by Infineon Technologies! As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in their Insulated Gate Bipolar Transistors. This N-CHANNEL IGBT offers a single configuration with a built-in diode, making it ideal for a wide range of applications. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of 830ns, this transistor provides exceptional performance and efficiency. Trust Infineon to deliver superior technology that meets your power needs. Experience the value and advantages that the FD200R12KE3HOSA1 brings to your projects today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them a good choice for power electronics applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to provide reverse recovery protection, improving the reliability of the IGBT.

Nominal Turn Off Time (toff): 830 ns

The fast turn off time allows for efficient switching and helps reduce power losses in high-speed applications.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum voltage rating allows this IGBT to be used for high voltage applications, providing robust performance.

Maximum Collector Current (IC): 295 A

The high collector current rating enables the IGBT to handle large amounts of current, making it suitable for high power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD200R12KE3HOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

830 ns

Nominal Turn On Time (ton):

400 ns

Trade Compliance

FD200R12KE3HOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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