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FGA25N120ANTDTU-F109

Onsemi

FGA25N120ANTDTU-F109 by Onsemi

FGA25N120ANTDTU-F109 by Onsemi is an N-CHANNEL IGBT with 90 ns rise time, 180 ns fall time, and 312 W power dissipation. Ideal for high-power applications requiring a max collector-emitter voltage of 1200 V and a collector current of 50 A. Operating temperature up to 150°C makes it suitable for industrial use.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$2.550

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10

$2.550

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Flip Electronics

USA . 62,100 parts In-Stock

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Vyrian

USA . 6,331 parts In-Stock

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Digiode

USA . 1,461 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$1.540

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$1.540

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Corohmni

South Africa . 403 parts In-Stock

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$2.499

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403

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Continental Prestige Electronics

USA . 4,750 parts In-Stock

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$2.550

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$2.499

4,750

$2.550

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$2.499

Argo Parts USA

USA . 2,289 parts In-Stock

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$2.550

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$2.550

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Netroflash

USA . 2,000 parts In-Stock

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$2.550

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$2.422

10k+ parts

$2.371

2,000

$2.550

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$2.422

$2.371

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$2.601

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$2.601

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$2.601

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500

$2.601

$2.601

$2.601

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AZTECH Wire

Italy . 612 parts In-Stock

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$18.507

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612

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Semicontronic

India . 302 parts In-Stock

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$25.050

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$24.424

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$24.298

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302

$25.050

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Ampacity Inc.

Singapore . 1,228 parts In-Stock

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$58.050

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RC Electronics

USA . 38,968 parts In-Stock

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Kepictronics

USA . 21,360 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,947 parts In-Stock

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Lixinc

USA . 6,964 parts In-Stock

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TANS Electronics

Latvia . 6,138 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Problanco Electronics

Mexico . 3,623 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Supply Digital

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Kulean Microsystems

USA . 753 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 253 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$17.395

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$17.395

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$17.395

$17.395

UHIMA Technologies

Türkiye . 11 parts In-Stock

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Overview

Experience unmatched performance and reliability with the FGA25N120ANTDTU-F109 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and cutting-edge technology in their Insulated Gate Bipolar Transistors (IGBT). With fast rise and fall times, high power dissipation, and a wide operating temperature range, this N-CHANNEL transistor is perfect for a variety of applications. Trust in Onsemi to deliver superior products that provide value, efficiency, and innovation to meet all your needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

The N-channel design allows for efficient control of current flow, making this IGBT suitable for a variety of applications.

Maximum Rise Time (tr): 90 ns

With a fast rise time, this IGBT enables quick switching capabilities, ideal for high-frequency applications.

Maximum Fall Time (tf): 180 ns

The fast fall time of 180 ns ensures quick turn-off characteristics, improving overall circuit efficiency.

Maximum Power Dissipation (Abs): 312 W

With a high power dissipation rating, this IGBT can handle significant power loads, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for operation in demanding environments without compromising performance.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating of 1200 V provides ample headroom for voltage spikes, making this IGBT suitable for high-power applications.

Maximum Gate-Emitter Voltage: 20 V

The 20 V gate-emitter voltage rating ensures safe and reliable operation within the specified limits, enhancing device longevity.

Maximum Collector Current (IC): 50 A

The high collector current rating of 50 A allows for handling of large current loads, making this IGBT versatile for various applications.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

The 7.5 V gate-emitter threshold voltage ensures precise and reliable switching behavior, contributing to overall system efficiency.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides excellent solderability and thermal conductivity, aiding in seamless integration into circuit designs.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGA25N120ANTDTU-F109 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

180 ns

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

90 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Trade Compliance

FGA25N120ANTDTU-F109 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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