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FGA25S125P-SN00337

Onsemi

FGA25S125P-SN00337 by Onsemi

FGA25S125P-SN00337 by Onsemi is an N-CHANNEL IGBT with 1250V VCE, 50A IC, and 250W power dissipation. Ideal for power control applications, it features a built-in diode, 2.35V VCEsat, and operates b/w -55 °C to 175°C temperature range.

Median Price

$3.130

Lifecycle Status

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10

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 348 parts In-Stock

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$3.360

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348

$3.360

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Arrow

USA . 255 parts In-Stock

1+ parts

$4.274

100+ parts

$2.999

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$2.646

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255

$4.274

$2.999

$2.646

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Flip Electronics (Authorized)

USA . 5,850 parts In-Stock

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5,850

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Rochester

USA . 412 parts In-Stock

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$2.590

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$2.320

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$2.180

412

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$2.590

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$2.180

DigiKey

USA . 412 parts In-Stock

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$3.410

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412

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$3.410

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Verical

USA . 412 parts In-Stock

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$2.900

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$2.725

412

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$2.725

Farnell

UK . 412 parts In-Stock

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$2.810

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412

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$2.810

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Distributors (In-Stock)

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Digiode

USA . 1,144 parts In-Stock

1+ parts

$1.174

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$1.174

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Vyrian

USA . 1,143 parts In-Stock

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$1.236

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$1.236

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Flip Electronics

USA . 5,850 parts In-Stock

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5,850

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Distributors (Availability)

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Native Components

USA . 351 parts In-Stock

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$0.540

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351

$0.540

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Northwest PG Solutions

USA . 1,395 parts In-Stock

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$0.594

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1,395

$0.594

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Ampacity Inc.

Singapore . 964 parts In-Stock

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$1.050

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964

$1.050

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Corphita

USA . 1,277 parts In-Stock

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$1.112

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$1.112

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Corohmni

South Africa . 222 parts In-Stock

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$1.236

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Microchip USA

USA . 3,393 parts In-Stock

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$18.070

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Kulean Microsystems

USA . 2,790 parts In-Stock

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Supply Digital

USA . 2,467 parts In-Stock

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SupplyDigital Components

Austria . 2,345 parts In-Stock

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TANS Electronics

Latvia . 2,052 parts In-Stock

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Problanco Electronics

Mexico . 1,268 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 714 parts In-Stock

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Kepictronics

USA . 450 parts In-Stock

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Continental Prestige Electronics

USA . 412 parts In-Stock

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$2.810

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Overview

Unleash the power of innovation with the FGA25S125P-SN00337 by Onsemi. As a leader in the manufacturing of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-notch quality and reliability. This N-CHANNEL transistor with a built-in diode is perfect for power control applications, offering a maximum collector-emitter voltage of 1250V and a maximum collector current of 50A. With a nominal turn-off time of 722ns and a nominal turn-on time of 325.2ns, this transistor ensures efficient performance. Upgrade your projects with the FGA25S125P-SN00337 and experience unparalleled value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower on-state voltage drop and higher switching speeds compared to P-Channel types, making them suitable for high power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier implementation of reverse current protection and simplifies the circuit design.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, making it suitable for use in motor drives, inverters, and other high-power industrial equipment.

Maximum VCEsat: 2.35 V

Low VCEsat helps in reducing power losses and improving efficiency in power control applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and efficient use of space in the circuit design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring reliable electrical connections.

Nominal Turn Off Time (toff): 722 ns

Fast turn-off time helps in reducing switching losses and improving overall efficiency of power control.

No. of Terminals: 3

Simplified connection with only three terminals, making it easy to integrate into circuit designs.

Maximum Power Dissipation (Abs): 250 W

High maximum power dissipation capability allows for handling high power levels without overheating or damage.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides mechanical stability and easy mounting on heat sinks for effective heat dissipation.

Maximum Operating Temperature: 175 °C

High maximum operating temperature range allows for reliable operation in a variety of environmental conditions.

Maximum Collector-Emitter Voltage: 1250 V

High maximum collector-emitter voltage rating allows for the handling of high voltage levels in power control applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its high electrical performance and reliability in power electronics applications.

Maximum Gate-Emitter Voltage: 25 V

High maximum gate-emitter voltage rating ensures safe operation and protection of the transistor during switching.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable operation even in extreme cold environments.

Maximum Collector Current (IC): 50 A

High maximum collector current rating allows for handling of high currents in power control applications.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

Suitable gate-emitter threshold voltage for efficient switching and control of the transistor in power applications.

Terminal Position: SINGLE

Single terminal position simplifies the connection layout and makes it easier to integrate into the circuit design.

Nominal Turn On Time (ton): 325.2 ns

Fast turn-on time provides quick response and efficient switching performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGA25S125P-SN00337 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1250 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

25 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

722 ns

Nominal Turn On Time (ton):

325.2 ns

Maximum VCEsat:

2.35 V

Trade Compliance

FGA25S125P-SN00337 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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