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FGA20S125P_SN00336

Onsemi

FGA20S125P_SN00336 by Onsemi

Onsemi's FGA20S125P_SN00336 is an N-CHANNEL IGBT with 1250V VCE, 40A IC, and 250W Ptot. Ideal for power control applications, it features a built-in diode in a plastic/epoxy package with flange mount style suitable for high-temperature environments up to 175 °C.

Median Price

$3.980

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,082 parts In-Stock

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$3.980

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$3.980

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$3.980

Flip Electronics (Authorized)

USA . 2,082 parts In-Stock

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Distributors (In-Stock)

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Vyrian

USA . 2,420 parts In-Stock

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$3.980

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$3.980

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Digiode

USA . 2,346 parts In-Stock

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2,346

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Flip Electronics

USA . 2,082 parts In-Stock

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2,082

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Distributors (Availability)

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Corohmni

South Africa . 482 parts In-Stock

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$3.980

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482

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TANS Electronics

Latvia . 8,300 parts In-Stock

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8,300

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Kulean Microsystems

USA . 6,953 parts In-Stock

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Problanco Electronics

Mexico . 6,293 parts In-Stock

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Supply Digital

USA . 2,880 parts In-Stock

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Corphita

USA . 1,540 parts In-Stock

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Northwest PG Solutions

USA . 1,157 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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SupplyDigital Components

Austria . 820 parts In-Stock

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820

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Kepictronics

USA . 450 parts In-Stock

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450

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Native Components

USA . 290 parts In-Stock

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290

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UHIMA Technologies

Türkiye . 181 parts In-Stock

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Overview

Unlock the power of precision and reliability with the FGA20S125P_SN00336 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this one, designed for optimal power control applications. With a single configuration and built-in diode, this transistor offers unmatched performance and efficiency. Trust Onsemi to provide innovative solutions for your electronic needs, ensuring maximum power dissipation, high voltage capability, and superior thermal management. Experience the difference with Onsemi's FGA20S125P_SN00336 - where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the IGBT lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and protects the IGBT from reverse current, enhancing its reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT provides efficient and reliable performance in controlling high power levels.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, ensuring robust performance in industrial environments.

No. of Terminals: 3

The 3 terminals provide the necessary connections for proper operation, offering flexibility in circuit design.

Maximum Power Dissipation (Abs): 250 W

With a high maximum power dissipation, this IGBT can handle large power levels without overheating, ensuring reliable operation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy installation and heat dissipation, making it suitable for demanding power control applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this IGBT to withstand harsh environmental conditions, ensuring stable performance in various applications.

Maximum Collector-Emitter Voltage: 1250 V

The high maximum collector-emitter voltage rating makes this IGBT suitable for high voltage applications, offering versatility in power control.

Transistor Element Material: SILICON

Silicon-based IGBTs are known for their high switching speed and efficiency, making them ideal for power control applications where performance is crucial.

Maximum Gate-Emitter Voltage: 25 V

The low maximum gate-emitter voltage allows for efficient gate control, ensuring accurate switching and power regulation in the circuit.

Maximum Collector Current (IC): 40 A

With a high maximum collector current rating, this IGBT can handle large current flows, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

The low gate-emitter threshold voltage ensures efficient gate control and minimal power losses, enhancing the overall performance of the IGBT.

Terminal Position: SINGLE

The single terminal position simplifies the connection and installation process, making it easy to integrate this IGBT into existing circuit designs.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGA20S125P_SN00336 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1250 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

25 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Trade Compliance

FGA20S125P_SN00336 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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