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F3L15R12W2H3B27BOMA1

Infineon Technologies

F3L15R12W2H3B27BOMA1 by Infineon Technologies

Infineon's F3L15R12W2H3B27BOMA1 IGBT is N-CHANNEL with 12 elements, VCEsat of 2.4V, and toff of 355ns. Ideal for power control applications, it has a max VCE of 1200V, IC of 20A, and ton of 67ns. Operating from -40 to +150 °C, UL approved for reliability.

Median Price

$53.955

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 589 parts In-Stock

1+ parts

-

100+ parts

$47.960

1k+ parts

$42.910

10k+ parts

$40.380

589

-

$47.960

$42.910

$40.380

Verical

USA . 555 parts In-Stock

1+ parts

-

100+ parts

$59.950

1k+ parts

$53.638

10k+ parts

$50.475

555

-

$59.950

$53.638

$50.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 223 parts In-Stock

1+ parts

$50.749

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-

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223

$50.749

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Nova Conductors

Japan . 1,000 parts In-Stock

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$63.470

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$63.470

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Vyrian

USA . 4,613 parts In-Stock

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DigiKey Marketplace

USA . 697 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$0.552

100+ parts

$0.502

1k+ parts

$0.453

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-

350

$0.552

$0.502

$0.453

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Aztec Data Supply Inc.

USA . 4,279 parts In-Stock

1+ parts

$0.980

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4,279

$0.980

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AZTECH Wire

Italy . 631 parts In-Stock

1+ parts

$11.090

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631

$11.090

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Andel Nordic

Denmark . 289 parts In-Stock

1+ parts

$39.200

100+ parts

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$27.441

10k+ parts

$27.441

289

$39.200

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$27.441

$27.441

Ampacity Inc.

Singapore . 237 parts In-Stock

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$45.410

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237

$45.410

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Semicontronic

India . 237 parts In-Stock

1+ parts

$45.410

100+ parts

$44.275

1k+ parts

$44.048

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237

$45.410

$44.275

$44.048

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Modulus Dynamics

Lithuania . 23,164 parts In-Stock

1+ parts

$48.075

100+ parts

$46.152

1k+ parts

$44.229

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23,164

$48.075

$46.152

$44.229

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Corohmni

South Africa . 202 parts In-Stock

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$48.075

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$48.075

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Corphita

USA . 68 parts In-Stock

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$48.078

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68

$48.078

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Continental Prestige Electronics

USA . 4,489 parts In-Stock

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$57.670

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$56.516

4,489

$57.670

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$56.516

Microchip USA

USA . 280 parts In-Stock

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$117.944

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$117.944

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QUARKTWIN TECHNOLOGY LTD

USA . 29,920 parts In-Stock

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Argo Parts USA

USA . 3,186 parts In-Stock

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Perfect Parts

USA . 1,562 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$62.201

1k+ parts

$60.297

10k+ parts

$59.027

1,000

-

$62.201

$60.297

$59.027

Overview

Unlock the power of advanced technology with the F3L15R12W2H3B27BOMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon is known for delivering top-quality products like this Insulated Gate Bipolar Transistor (IGBT). Ideal for power control applications, this N-CHANNEL transistor boasts a complex configuration and superior performance. With a maximum VCEsat of 2.4V and a maximum operating temperature of 150°C, customers can trust in the reliability and efficiency of this product to meet their needs. Experience the value and benefits that Infineon brings to the table with the F3L15R12W2H3B27BOMA1.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL IGBTs are known for their efficiency and fast switching speeds, making them ideal for high power applications.

Maximum VCEsat

With a low VCEsat value, this IGBT can ensure minimal power loss and high energy efficiency during operation.

Maximum Power Dissipation (Abs)

With a high power dissipation capability, this IGBT can handle heavy loads and operate reliably in demanding power control applications.

Maximum Operating Temperature

The high maximum operating temperature allows this IGBT to withstand elevated temperatures and maintain performance in harsh environments.

Maximum Collector-Emitter Voltage

The high collector-emitter voltage rating enables this IGBT to be used in high voltage circuits and power control systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) F3L15R12W2H3B27BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X34

No. of Elements:

12

No. of Terminals:

34

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

355 ns

Nominal Turn On Time (ton):

67 ns

Maximum VCEsat:

2.4 V

Trade Compliance

F3L15R12W2H3B27BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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