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F3L150R12W2H3B11BPSA1

Infineon Technologies

F3L150R12W2H3B11BPSA1 by Infineon Technologies

F3L150R12W2H3B11BPSA1 by Infineon Technologies is an N-CHANNEL IGBT with 4 elements, 1200V max collector-emitter voltage, and 510ns turn-off time. It is used in applications requiring high power switching such as industrial motor drives and renewable energy systems.

Median Price

$83.282

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1 parts In-Stock

1+ parts

$52.540

100+ parts

$46.370

1k+ parts

-

10k+ parts

-

1

$52.540

$46.370

-

-

DigiKey

USA . 5 parts In-Stock

1+ parts

$59.960

100+ parts

$44.553

1k+ parts

-

10k+ parts

-

5

$59.960

$44.553

-

-

Verical

USA . 5 parts In-Stock

1+ parts

$82.364

100+ parts

-

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5

$82.364

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Chip1Stop

Japan . 5 parts In-Stock

1+ parts

$84.200

100+ parts

-

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-

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5

$84.200

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-

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Element14

Singapore . 1 parts In-Stock

1+ parts

$88.250

100+ parts

$69.400

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-

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1

$88.250

$69.400

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-

Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$96.940

100+ parts

$80.070

1k+ parts

$80.070

10k+ parts

$80.070

11

$96.940

$80.070

$80.070

$80.070

Newark

USA . 1 parts In-Stock

1+ parts

$108.330

100+ parts

$95.050

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-

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1

$108.330

$95.050

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-

Rochester

USA . 17 parts In-Stock

1+ parts

-

100+ parts

$44.560

1k+ parts

$39.870

10k+ parts

$37.520

17

-

$44.560

$39.870

$37.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 419 parts In-Stock

1+ parts

$48.184

100+ parts

-

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419

$48.184

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$112.270

100+ parts

$101.480

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100

$112.270

$101.480

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Vyrian

USA . 2,346 parts In-Stock

1+ parts

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2,346

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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Corohmni

South Africa . 193 parts In-Stock

1+ parts

$0.577

100+ parts

-

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193

$0.577

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Modulus Dynamics

Lithuania . 17,899 parts In-Stock

1+ parts

$1.068

100+ parts

$1.025

1k+ parts

$0.983

10k+ parts

-

17,899

$1.068

$1.025

$0.983

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Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$43.110

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11

$43.110

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Corphita

USA . 326 parts In-Stock

1+ parts

$45.648

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326

$45.648

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Continental Prestige Electronics

USA . 22 parts In-Stock

1+ parts

$68.290

100+ parts

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22

$68.290

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QUARKTWIN TECHNOLOGY LTD

USA . 21,541 parts In-Stock

1+ parts

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21,541

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Microchip USA

USA . 10,251 parts In-Stock

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10,251

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Argo Parts USA

USA . 1,453 parts In-Stock

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1,453

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Overview

Transforming the way you power your devices, the F3L150R12W2H3B11BPSA1 by Infineon Technologies is a game-changer in the world of Insulated Gate Bipolar Transistors (IGBT). With unparalleled quality and reliability that Infineon is known for, this N-CHANNEL transistor offers advanced features and benefits that cater to a wide range of applications. Whether you're in the automotive industry or renewable energy sector, this complex configuration IGBT provides exceptional performance and efficiency. Say goodbye to power limitations and hello to endless possibilities with the F3L150R12W2H3B11BPSA1.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and higher current carrying capabilities compared to P-CHANNEL, making them suitable for high power applications.

Configuration: COMPLEX

Complex configuration allows for advanced control of the switching behavior, making the IGBT versatile and suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and efficient thermal management, enhancing the reliability and performance of the IGBT.

Nominal Turn Off Time (toff): 510 ns

Fast turn-off time of 510 ns enables the IGBT to quickly switch off, reducing power losses and improving efficiency in high-frequency applications.

No. of Terminals: 32

Having 32 terminals allows for complex control and connection options, making the IGBT suitable for sophisticated circuit designs.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage of 1200 V provides safe operation in high voltage applications, ensuring reliability and durability of the IGBT.

Transistor Element Material: SILICON

Silicon material offers high thermal conductivity and reliability, making the IGBT suitable for demanding industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40°C ensures the IGBT can withstand harsh environmental conditions, enhancing its versatility and reliability.

Nominal Turn On Time (ton): 210 ns

Fast turn-on time of 210 ns allows the IGBT to switch on quickly, improving overall efficiency and performance in power electronics applications.

Reference Standard: UL APPROVED

UL approval ensures the IGBT meets stringent safety and quality standards, providing peace of mind for users in various applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) F3L150R12W2H3B11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X32

No. of Elements:

4

No. of Terminals:

32

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

GENERAL PURPOSE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

510 ns

Nominal Turn On Time (ton):

210 ns

Trade Compliance

F3L150R12W2H3B11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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