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IRG4PC50FD-EPBF

Infineon Technologies

IRG4PC50FD-EPBF by Infineon Technologies

IRG4PC50FD-EPBF by Infineon Technologies is an N-CHANNEL IGBT with a max voltage of 600V and current of 70A. It has a turn-off time of 660ns and turn-on time of 86ns, making it ideal for power control applications. The transistor comes in a rectangular package with through-hole terminals for easy installation.

Median Price

$3.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 521 parts In-Stock

1+ parts

$3.270

100+ parts

$3.200

1k+ parts

$3.140

10k+ parts

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521

$3.270

$3.200

$3.140

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Distributors (In-Stock)

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Digiode

USA . 980 parts In-Stock

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$3.106

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980

$3.106

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Vyrian

USA . 7,414 parts In-Stock

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7,414

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 21,790 parts In-Stock

1+ parts

$0.931

100+ parts

$0.894

1k+ parts

$0.857

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-

21,790

$0.931

$0.894

$0.857

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Aztec Data Supply Inc.

USA . 260 parts In-Stock

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$1.030

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260

$1.030

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Corohmni

South Africa . 37 parts In-Stock

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$1.990

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37

$1.990

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Ampacity Inc.

Singapore . 164 parts In-Stock

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$2.780

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164

$2.780

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Corphita

USA . 112 parts In-Stock

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$2.943

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112

$2.943

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AZTECH Wire

Italy . 256 parts In-Stock

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$16.975

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256

$16.975

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Continental Prestige Electronics

USA . 5,183 parts In-Stock

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Argo Parts USA

USA . 2,917 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Perfect Parts

USA . 1,077 parts In-Stock

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1,077

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Microchip USA

USA . 495 parts In-Stock

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495

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unleash the power of Infineon Technologies with the IRG4PC50FD-EPBF Insulated Gate Bipolar Transistor. This high-quality transistor offers unparalleled performance in power control applications, making it a must-have for any project that requires reliable and efficient operation. With its N-channel configuration, built-in diode, and robust construction, this transistor delivers exceptional value and benefits to customers looking for top-of-the-line components. Trust Infineon Technologies to provide cutting-edge solutions for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good insulation and protection for the internal components, ensuring durability and reliability in various operating conditions.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space by eliminating the need for an external diode, making the product more efficient and cost-effective.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT delivers high performance and efficiency in controlling large power loads, making it a suitable choice for power electronics systems.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum collector-emitter voltage rating of 600V, this IGBT can handle high voltage levels, making it ideal for applications that require voltage regulation and power switching.

Maximum Collector Current (IC): 70 A

With a high maximum collector current rating of 70A, this IGBT is capable of handling high current levels, making it suitable for power control applications that require efficient current handling.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC50FD-EPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

ULTRA FAST SOFT RECOVERY

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

660 ns

Nominal Turn On Time (ton):

86 ns

Trade Compliance

IRG4PC50FD-EPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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