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FGH40N60SFDTU-F085

Onsemi

FGH40N60SFDTU-F085 by Onsemi

FGH40N60SFDTU-F085 by Onsemi is an N-CHANNEL IGBT with 600V VCEsat, 80A IC, and 290W power dissipation. Ideal for power control applications, it features a built-in diode, 54ns fall time, and -55 to 150°C operating temperature range.

Median Price

$5.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 900 parts In-Stock

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$2.200

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900

$2.200

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$9.180

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900

$9.180

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Digiode

USA . 4,244 parts In-Stock

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4,244

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Vyrian

USA . 1,267 parts In-Stock

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1,267

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DigiKey Marketplace

USA . 900 parts In-Stock

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$1.199

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1,000

$1.199

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Continental Prestige Electronics

USA . 10,302 parts In-Stock

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$2.360

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$2.313

10,302

$2.360

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$2.313

Argo Parts USA

USA . 5,328 parts In-Stock

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$2.360

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$2.360

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Corohmni

South Africa . 450 parts In-Stock

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$8.996

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450

$8.996

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$9.180

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2,000

$9.180

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AZTECH Wire

Italy . 924 parts In-Stock

1+ parts

$12.490

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924

$12.490

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Ampacity Inc.

Singapore . 1,452 parts In-Stock

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$58.050

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$58.050

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Component Stockers USA

USA . 647 parts In-Stock

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$99.990

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647

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 21,738 parts In-Stock

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21,738

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Microchip USA

USA . 9,686 parts In-Stock

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Kulean Microsystems

USA . 8,482 parts In-Stock

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Problanco Electronics

Mexico . 8,399 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 4,121 parts In-Stock

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SupplyDigital Components

Austria . 3,581 parts In-Stock

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3,581

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TANS Electronics

Latvia . 3,052 parts In-Stock

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Supply Digital

USA . 1,284 parts In-Stock

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UHIMA Technologies

Türkiye . 324 parts In-Stock

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324

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Overview

Unleash the power of the FGH40N60SFDTU-F085 from Onsemi, a top-tier manufacturer of cutting-edge Insulated Gate Bipolar Transistors (IGBT). This single with built-in diode transistor is perfect for power control applications, offering a maximum VCEsat of 2.9V and a maximum collector-emitter voltage of 600V. With a maximum power dissipation of 290W and a package shape of rectangular, this IGBT ensures efficient performance at temperatures ranging from -55 to 150°C. Elevate your projects with the reliability and quality that Onsemi is known for, and experience the unparalleled value and benefits that the FGH40N60SFDTU-F085 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring long-term reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have better performance and efficiency compared to P-channel IGBTs, making them a preferred choice for power control applications.

Maximum VCEsat: 2.9 V

Low VCEsat value reduces power losses and improves overall efficiency of the transistor.

Maximum Power Dissipation (Abs): 290 W

High power dissipation capability allows the transistor to handle large amounts of power without thermal issues, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures that the transistor can operate reliably in harsh environments without overheating.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating allows the transistor to be used in a wide range of high-voltage applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N60SFDTU-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

54 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

192 ns

Nominal Turn On Time (ton):

60 ns

Maximum VCEsat:

2.9 V

Trade Compliance

FGH40N60SFDTU-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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