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FGH40N60SMD-F085

Onsemi

FGH40N60SMD-F085 by Onsemi

FGH40N60SMD-F085 by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V and max power dissipation of 349W. Ideal for power control applications, it features a single configuration with built-in diode and operates at temperatures up to 175°C.

Median Price

$5.324

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 210 parts In-Stock

1+ parts

$6.467

100+ parts

$3.573

1k+ parts

$3.187

10k+ parts

-

210

$6.467

$3.573

$3.187

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Mouser Electronics

USA . 783 parts In-Stock

1+ parts

$7.730

100+ parts

$3.810

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-

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783

$7.730

$3.810

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DigiKey

USA . 443 parts In-Stock

1+ parts

$7.750

100+ parts

$4.487

1k+ parts

$3.770

10k+ parts

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443

$7.750

$4.487

$3.770

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Verical

USA . 423 parts In-Stock

1+ parts

-

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$4.100

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$3.663

10k+ parts

$3.450

423

-

$4.100

$3.663

$3.450

Rochester

USA . 393 parts In-Stock

1+ parts

-

100+ parts

$3.280

1k+ parts

$2.930

10k+ parts

$2.760

393

-

$3.280

$2.930

$2.760

Chip1Stop

Japan . 270 parts In-Stock

1+ parts

-

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$4.180

1k+ parts

$3.750

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270

-

$4.180

$3.750

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 614 parts In-Stock

1+ parts

$4.600

100+ parts

-

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614

$4.600

-

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Digiode

USA . 1,511 parts In-Stock

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$6.308

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1,511

$6.308

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Flip Electronics

USA . 50,400 parts In-Stock

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50,400

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Vyrian

USA . 40 parts In-Stock

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40

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 921 parts In-Stock

1+ parts

$1.187

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-

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921

$1.187

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Corohmni

South Africa . 11 parts In-Stock

1+ parts

$1.659

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11

$1.659

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Ampacity Inc.

Singapore . 497 parts In-Stock

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$2.680

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497

$2.680

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Semicontronic

India . 15 parts In-Stock

1+ parts

$2.680

100+ parts

$2.613

1k+ parts

$2.600

10k+ parts

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15

$2.680

$2.613

$2.600

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Continental Prestige Electronics

USA . 6,781 parts In-Stock

1+ parts

$4.600

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$4.508

6,781

$4.600

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$4.508

Netroflash

USA . 150 parts In-Stock

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$4.600

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$4.508

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150

$4.600

$4.508

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Corphita

USA . 1,180 parts In-Stock

1+ parts

$5.976

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1,180

$5.976

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Microchip USA

USA . 443 parts In-Stock

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$18.564

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443

$18.564

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Component Stockers USA

USA . 935 parts In-Stock

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$63.580

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935

$63.580

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Lixinc

USA . 7,628 parts In-Stock

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7,628

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Argo Parts USA

USA . 6,145 parts In-Stock

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Kulean Microsystems

USA . 5,201 parts In-Stock

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TANS Electronics

Latvia . 2,930 parts In-Stock

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2,930

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UHIMA Technologies

Türkiye . 838 parts In-Stock

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838

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SupplyDigital Components

Austria . 629 parts In-Stock

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629

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iodParts Technologies Inc.

India . 542 parts In-Stock

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542

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Supply Digital

USA . 511 parts In-Stock

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511

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Problanco Electronics

Mexico . 356 parts In-Stock

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Perfect Parts

USA . 323 parts In-Stock

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323

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Overview

Unleash the power of innovation with the FGH40N60SMD-F085 by Onsemi. Crafted with precision and expertise, this Insulated Gate Bipolar Transistor (IGBT) boasts unparalleled quality and reliability. From power control to industrial applications, this N-CHANNEL transistor with a built-in diode offers exceptional performance and efficiency. Elevate your projects with the superior value and benefits of this product, designed to exceed expectations and deliver seamless operation. Trust Onsemi for cutting-edge technology that propels your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring durability and reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, making it efficient and effective in managing power flow.

Maximum Power Dissipation (Abs): 349 W

With a high maximum power dissipation, this IGBT can handle large amounts of power without overheating, increasing its overall performance and longevity.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating allows this IGBT to be used in a wide range of voltage applications, adding versatility to its usage.

Maximum Collector Current (IC): 80 A

With a high collector current rating, this IGBT can handle large current loads, making it suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N60SMD-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

81 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

36.4 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

172.5 ns

Nominal Turn On Time (ton):

43.7 ns

Trade Compliance

FGH40N60SMD-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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