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FP10R12W1T4PB11BPSA1

Infineon Technologies

FP10R12W1T4PB11BPSA1 by Infineon Technologies

Infineon's FP10R12W1T4PB11BPSA1 is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 20A max collector current, and 500ns nominal turn off time. Ideal for power control applications due to its complex configuration and silicon transistor element material.

Median Price

$28.204

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,416 parts In-Stock

1+ parts

-

100+ parts

$25.070

1k+ parts

$22.430

10k+ parts

$21.110

1,416

-

$25.070

$22.430

$21.110

Verical

USA . 1,140 parts In-Stock

1+ parts

-

100+ parts

$31.337

1k+ parts

$28.038

10k+ parts

$26.387

1,140

-

$31.337

$28.038

$26.387

DigiKey

USA . 66 parts In-Stock

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66

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Digiode

USA . 617 parts In-Stock

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$30.048

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617

$30.048

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Vyrian

USA . 9,148 parts In-Stock

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9,148

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 299 parts In-Stock

1+ parts

$1.070

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-

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299

$1.070

-

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$25.060

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1

$25.060

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Semicontronic

India . 513 parts In-Stock

1+ parts

$26.890

100+ parts

$26.218

1k+ parts

$26.083

10k+ parts

-

513

$26.890

$26.218

$26.083

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Ampacity Inc.

Singapore . 367 parts In-Stock

1+ parts

$26.890

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367

$26.890

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Corphita

USA . 371 parts In-Stock

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$28.467

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371

$28.467

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Modulus Dynamics

Lithuania . 14,259 parts In-Stock

1+ parts

$31.348

100+ parts

$30.094

1k+ parts

$28.840

10k+ parts

-

14,259

$31.348

$30.094

$28.840

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Corohmni

South Africa . 17 parts In-Stock

1+ parts

$31.348

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17

$31.348

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Microchip USA

USA . 8,735 parts In-Stock

1+ parts

$102.880

100+ parts

$101.090

1k+ parts

$100.200

10k+ parts

$99.300

8,735

$102.880

$101.090

$100.200

$99.300

QUARKTWIN TECHNOLOGY LTD

USA . 9,657 parts In-Stock

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9,657

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Argo Parts USA

USA . 3,170 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

From Infineon Technologies comes the FP10R12W1T4PB11BPSA1, a top-notch Insulated Gate Bipolar Transistor that sets a new standard in power control. With 7 elements and a N-CHANNEL polarity, this transistor offers unparalleled performance and reliability. Whether used in industrial machinery or renewable energy systems, this complex configuration transistor ensures smooth operation and efficient power management. Experience the quality and innovation of Infineon Technologies with the FP10R12W1T4PB11BPSA1, providing customers with value and benefits that truly make a difference in their applications.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is capable of handling high voltage and current levels efficiently.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT can withstand voltage spikes and surges, ensuring reliable performance in power control applications.

Maximum Collector Current (IC): 20 A

Capable of handling high current levels, this IGBT is suitable for power control applications that require a high power output.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP10R12W1T4PB11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

500 ns

Nominal Turn On Time (ton):

108 ns

Trade Compliance

FP10R12W1T4PB11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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