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FP100R12KT4BOSA1

Infineon Technologies

FP100R12KT4BOSA1 by Infineon Technologies

FP100R12KT4BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements, 1200V max collector-emitter voltage, and 620ns turn off time. It is used in applications requiring high power switching such as industrial motor drives and renewable energy systems due to its complex configuration and silicon transistor element material.

Median Price

$115.330

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 12 parts In-Stock

1+ parts

$69.380

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-

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12

$69.380

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DigiKey

USA . 17 parts In-Stock

1+ parts

$111.870

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17

$111.870

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Farnell

UK . 7 parts In-Stock

1+ parts

$112.510

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7

$112.510

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Chip1Stop

Japan . 17 parts In-Stock

1+ parts

$129.000

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17

$129.000

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Arrow

USA . 48 parts In-Stock

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$145.924

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48

$145.924

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Element14

Singapore . 22 parts In-Stock

1+ parts

$238.668

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22

$238.668

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Rochester

USA . 276 parts In-Stock

1+ parts

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$94.520

1k+ parts

$84.570

10k+ parts

$79.590

276

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$94.520

$84.570

$79.590

Verical

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$118.150

1k+ parts

$105.713

10k+ parts

$99.487

260

-

$118.150

$105.713

$99.487

RS (Exports)

UK . 6 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 863 parts In-Stock

1+ parts

$95.709

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-

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863

$95.709

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Nova Conductors

Japan . 10 parts In-Stock

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$205.770

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10

$205.770

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TodayComponents

USA . 100 parts In-Stock

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$291.750

100+ parts

$263.710

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100

$291.750

$263.710

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Vyrian

USA . 2,345 parts In-Stock

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2,345

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TME

Poland . 18 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 12,586 parts In-Stock

1+ parts

$1.819

100+ parts

$1.746

1k+ parts

$1.673

10k+ parts

-

12,586

$1.819

$1.746

$1.673

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Corohmni

South Africa . 51 parts In-Stock

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$1.936

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51

$1.936

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AZTECH Wire

Italy . 340 parts In-Stock

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$15.481

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340

$15.481

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Ampacity Inc.

Singapore . 69 parts In-Stock

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$85.630

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69

$85.630

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Corphita

USA . 443 parts In-Stock

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$90.671

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443

$90.671

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Continental Prestige Electronics

USA . 19 parts In-Stock

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$176.400

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19

$176.400

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$201.655

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$193.588

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500

$201.655

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$193.588

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Microchip USA

USA . 5,549 parts In-Stock

1+ parts

$336.330

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5,549

$336.330

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Glotronic Ltd.

UK . 424 parts In-Stock

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424

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Overview

Unleash the power of innovation with the FP100R12KT4BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor offers a complex configuration with 7 elements, ensuring optimal performance in a variety of applications. With a maximum collector-emitter voltage of 1200V and a nominal turn on time of 210 ns, this product provides unmatched value and reliability for customers seeking high-end solutions. Elevate your projects to the next level with the FP100R12KT4BOSA1 from Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching capabilities, making them suitable for high-performance applications.

Configuration: COMPLEX

A complex configuration allows for better control and flexibility in various power electronics applications.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and integration into electronic circuits.

Nominal Turn Off Time (toff): 620 ns

The fast turn off time of 620 ns ensures efficient switching operation, reducing power losses and heat generation.

No. of Terminals: 35

With 35 terminals, this IGBT provides various connection options for versatile applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this IGBT can handle high temperature environments, increasing its reliability and longevity.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage of 1200 V allows for handling high voltage applications with ease.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its high efficiency and reliability, making this IGBT a durable choice.

Terminal Position: UPPER

Having the terminal position as upper makes the connections more accessible and easier to work with.

Case Connection: ISOLATED

Isolated case connection enhances safety and allows for better thermal management in high voltage applications.

Nominal Turn On Time (ton): 210 ns

The fast turn on time of 210 ns ensures quick response and high efficiency in switching operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP100R12KT4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

620 ns

Nominal Turn On Time (ton):

210 ns

Trade Compliance

FP100R12KT4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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