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FF450R12ME4EB11BPSA1

Infineon Technologies

FF450R12ME4EB11BPSA1 by Infineon Technologies

FF450R12ME4EB11BPSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, a 740 ns turn off time, and 1200V max collector-emitter voltage. It is used in applications requiring high power switching such as industrial motor drives and renewable energy systems.

Median Price

$203.137

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 630 parts In-Stock

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$172.880

100+ parts

$162.510

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$152.130

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630

$172.880

$162.510

$152.130

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DigiKey

USA . 630 parts In-Stock

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$216.100

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630

$216.100

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Verical

USA . 291 parts In-Stock

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$203.137

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$190.162

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291

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$190.162

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Distributors (In-Stock)

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TME

Poland . 2 parts In-Stock

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$178.010

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Digiode

USA . 315 parts In-Stock

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$191.168

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Nova Conductors

Japan . 100 parts In-Stock

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$209.840

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TodayComponents

USA . 100 parts In-Stock

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$275.760

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$249.270

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Vyrian

USA . 9,068 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 1,045 parts In-Stock

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$0.989

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1,045

$0.989

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Aztec Data Supply Inc.

USA . 201 parts In-Stock

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$1.183

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$1.183

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Modulus Dynamics

Lithuania . 2,305 parts In-Stock

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$1.785

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$1.714

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$1.642

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2,305

$1.785

$1.714

$1.642

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Semicontronic

India . 89 parts In-Stock

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$171.050

100+ parts

$166.774

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$165.918

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89

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$165.918

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Corphita

USA . 682 parts In-Stock

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$181.107

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Continental Prestige Electronics

USA . 4,914 parts In-Stock

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$205.730

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$201.615

4,914

$205.730

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$201.615

Microchip USA

USA . 6,558 parts In-Stock

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$308.595

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Ampacity Inc.

Singapore . 116 parts In-Stock

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$372.280

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Argo Parts USA

USA . 4,623 parts In-Stock

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Bastille Electronics

Australia . 1,824 parts In-Stock

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Perfect Parts

USA . 27 parts In-Stock

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Overview

Experience superior performance and reliability with the FF450R12ME4EB11BPSA1 Insulated Gate Bipolar Transistor from Infineon Technologies. Designed for efficiency and durability, this N-CHANNEL transistor boasts a series connected, center tap configuration with built-in diode and thermistor, making it ideal for a wide range of applications. With its advanced technology and high-quality construction, this product offers customers unparalleled value, benefits, and advantages in their projects. Trust in Infineon Technologies to deliver excellence in every component.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower conduction losses and higher efficiency compared to P-CHANNEL IGBTs, making them a good choice for high power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for improved current handling capacity and efficiency, making it suitable for high power applications.

Package Shape: RECTANGULAR

Rectangular packages are typically easier to mount and provide better thermal management compared to other shapes, improving overall reliability.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT can be used in applications requiring high voltage switching operations.

Maximum Collector Current (IC): 675 A

The high collector current rating allows for handling large currents, making this IGBT suitable for high power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R12ME4EB11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

740 ns

Nominal Turn On Time (ton):

290 ns

Trade Compliance

FF450R12ME4EB11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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