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NGTB40N120FL3WG

Onsemi

NGTB40N120FL3WG by Onsemi

NGTB40N120FL3WG by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 1.95V and a max collector-emitter voltage of 1200V. It is designed for power control applications, featuring a nominal turn off time of 326ns and a max operating temperature of 175°C.

Median Price

$3.529

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,458 parts In-Stock

1+ parts

$6.640

100+ parts

$3.800

1k+ parts

$2.716

10k+ parts

$2.679

2,458

$6.640

$3.800

$2.716

$2.679

Verical

USA . 14,970 parts In-Stock

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-

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$2.753

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$2.659

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14,970

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$2.753

$2.659

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Arrow

USA . 10,410 parts In-Stock

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$3.529

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$2.741

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10,410

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$3.529

$2.741

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$4.626

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10

$4.626

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Digiode

USA . 833 parts In-Stock

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$6.412

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833

$6.412

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TME

Poland . 15 parts In-Stock

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$7.180

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15

$7.180

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Chip Stock

USA . 13,507 parts In-Stock

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Vyrian

USA . 5,600 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 18,285 parts In-Stock

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$0.660

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18,285

$0.660

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Microchip USA

USA . 1,646 parts In-Stock

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$2.728

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1,646

$2.728

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Ampacity Inc.

Singapore . 7,606 parts In-Stock

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$3.000

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7,606

$3.000

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Semicontronic

India . 5,492 parts In-Stock

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$3.000

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$2.925

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$2.910

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5,492

$3.000

$2.925

$2.910

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Corohmni

South Africa . 254 parts In-Stock

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$4.443

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254

$4.443

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Continental Prestige Electronics

USA . 5,209 parts In-Stock

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$4.626

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$4.534

5,209

$4.626

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$4.534

Corphita

USA . 134 parts In-Stock

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$6.075

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$6.075

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iodParts Technologies Inc.

India . 74,371 parts In-Stock

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Perfect Parts

USA . 67,562 parts In-Stock

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Robosynatics

Brazil . 12,320 parts In-Stock

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Lucentia Tech

USA . 12,320 parts In-Stock

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$1.677

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$1.643

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$1.643

12,320

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$1.643

$1.643

TANS Electronics

Latvia . 8,223 parts In-Stock

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RC Electronics

USA . 8,218 parts In-Stock

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SupplyDigital Components

Austria . 4,283 parts In-Stock

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Lixinc

USA . 2,955 parts In-Stock

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Kulean Microsystems

USA . 2,809 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 2,241 parts In-Stock

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Argo Parts USA

USA . 2,128 parts In-Stock

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UHIMA Technologies

Türkiye . 882 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$4.534

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$4.395

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$4.302

500

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$4.534

$4.395

$4.302

Overview

Power up your projects with the NGTB40N120FL3WG from Onsemi, a top-quality Insulated Gate Bipolar Transistor (IGBT) that offers unparalleled performance and reliability. Whether you're working on power control applications or looking to optimize your electronic designs, this N-CHANNEL transistor with built-in diode is sure to exceed your expectations. With a maximum VCEsat of 1.95V and a maximum operating temperature of 175°C, this IGBT delivers exceptional power dissipation capabilities. Trust Onsemi's expertise in semiconductor manufacturing to bring you a product that combines cutting-edge technology with superior quality. Elevate your projects with the NGTB40N120FL3WG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses and higher efficiency, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this IGBT ideal for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers high efficiency and reliability in controlling large amounts of power.

Maximum VCEsat: 1.95 V

With a low VCEsat value, this IGBT minimizes power dissipation and improves overall efficiency in power control applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient heat dissipation, ensuring reliable performance under high power loads.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and ease of soldering, making installation and maintenance hassle-free.

Nominal Turn Off Time (toff): 326 ns

With a fast turn-off time, this IGBT allows for quick switching and precise control, improving the performance of power control systems.

Maximum Power Dissipation (Abs): 454 W

The high maximum power dissipation capability of 454W ensures the IGBT can handle high power levels without overheating or failure.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers easy installation and secure mounting, making it suitable for industrial power control applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this IGBT can withstand extreme thermal conditions, ensuring reliable operation in harsh environments.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage allows the IGBT to handle high voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistor elements due to its high conductivity and reliability, ensuring long-term performance of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

The 20V maximum gate-emitter voltage provides a safety margin for the IGBT, preventing voltage spikes from damaging the device.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this IGBT can operate reliably in cold environments without performance degradation.

Maximum Collector Current (IC): 80 A

The high maximum collector current rating of 80A allows the IGBT to handle large current loads, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The 6.5V gate-emitter threshold voltage ensures accurate switching of the IGBT, improving the efficiency and reliability of power control systems.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and corrosion resistance, ensuring a reliable connection and long-term performance.

Terminal Position: SINGLE

The single terminal position simplifies installation and connections, reducing the risk of errors and ensuring proper functionality of the IGBT.

Nominal Turn On Time (ton): 51 ns

With a fast turn-on time, this IGBT allows for quick response and precise control, enhancing the performance of power control systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB40N120FL3WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

326 ns

Nominal Turn On Time (ton):

51 ns

Maximum VCEsat:

1.95 V

Trade Compliance

NGTB40N120FL3WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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