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NGTB20N120IHSWG

Onsemi

NGTB20N120IHSWG by Onsemi

NGTB20N120IHSWG by Onsemi is an N-CHANNEL IGBT with 1200V VCE, 40A IC, and 156W Pd. Ideal for high-power applications requiring efficient switching at up to 150 °C operating temperature.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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AZTECH Wire

Italy . 456 parts In-Stock

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Component Stockers USA

USA . 221 parts In-Stock

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Kulean Microsystems

USA . 7,783 parts In-Stock

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SupplyDigital Components

Austria . 6,007 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 1,962 parts In-Stock

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UHIMA Technologies

Türkiye . 622 parts In-Stock

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Perfect Parts

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Corohmni

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Overview

Enhance your electronic projects with the NGTB20N120IHSWG by Onsemi, a top-tier manufacturer known for delivering high-quality Insulated Gate Bipolar Transistors (IGBT). With its N-CHANNEL polarity and impressive specs, this component guarantees superior performance in various applications. Experience seamless operation and enhanced efficiency with a maximum power dissipation of 156W and a collector-emitter voltage of 1200V. Trust Onsemi to provide reliable solutions that elevate your projects to new heights. Unlock the potential of your designs with the NGTB20N120IHSWG – the perfect choice for those who demand excellence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for high power applications.

Maximum Power Dissipation (Abs): 156 W

With a high maximum power dissipation, this IGBT can handle large amounts of power without overheating, ensuring reliability in high-power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this IGBT to operate in a wide range of environments without overheating, increasing its durability and longevity.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage, this IGBT can handle high voltage applications with ease, making it suitable for a wide range of industrial uses.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20V ensures reliable and safe operation of the IGBT, protecting it from damage due to overvoltage conditions.

Maximum Collector Current (IC): 40 A

With a high maximum collector current, this IGBT can handle high currents without overheating, making it suitable for high-power applications such as motor control and power inverters.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The low gate-emitter threshold voltage of 6.5V allows for faster switching speeds and lower power losses, improving overall efficiency of the IGBT.

Terminal Finish: TIN

The TIN terminal finish provides enhanced durability and corrosion resistance, ensuring a longer lifespan for the IGBT in harsh operating conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB20N120IHSWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Trade Compliance

NGTB20N120IHSWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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