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NGTB10N60R2DT4G

Onsemi

NGTB10N60R2DT4G by Onsemi

NGTB10N60R2DT4G by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.3V and IC of 20A. It has a turn-off time of 220ns, making it suitable for high-power applications like motor drives and inverters. The device comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 585,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

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585,000

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-

$0.630

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Flip Electronics (Authorized)

USA . 585,000 parts In-Stock

1+ parts

-

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585,000

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Rochester

USA . 12,354 parts In-Stock

1+ parts

-

100+ parts

$0.740

1k+ parts

$0.614

10k+ parts

$0.547

12,354

-

$0.740

$0.614

$0.547

Verical

USA . 11,064 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.767

10k+ parts

$0.684

11,064

-

-

$0.767

$0.684

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.444

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50

$0.444

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Digiode

USA . 1,941 parts In-Stock

1+ parts

$0.577

100+ parts

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1,941

$0.577

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Flip Electronics

USA . 585,000 parts In-Stock

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585,000

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Vyrian

USA . 297,890 parts In-Stock

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297,890

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NAC Semi

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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Corohmni

South Africa . 334 parts In-Stock

1+ parts

$0.435

100+ parts

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334

$0.435

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Continental Prestige Electronics

USA . 5,988 parts In-Stock

1+ parts

$0.444

100+ parts

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1k+ parts

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$0.435

5,988

$0.444

-

-

$0.435

Argo Parts USA

USA . 4,393 parts In-Stock

1+ parts

$0.444

100+ parts

-

1k+ parts

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$0.431

4,393

$0.444

-

-

$0.431

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.444

100+ parts

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500

$0.444

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Ampacity Inc.

Singapore . 297,879 parts In-Stock

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$0.520

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297,879

$0.520

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Corphita

USA . 1,519 parts In-Stock

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$0.546

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1,519

$0.546

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Aztec Data Supply Inc.

USA . 30,135 parts In-Stock

1+ parts

$0.951

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30,135

$0.951

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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SupplyDigital Components

Austria . 5,644 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,923 parts In-Stock

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4,923

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Problanco Electronics

Mexico . 2,171 parts In-Stock

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Kulean Microsystems

USA . 1,754 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Futuretech Components

Singapore . 658 parts In-Stock

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658

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UHIMA Technologies

Türkiye . 601 parts In-Stock

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601

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TANS Electronics

Latvia . 560 parts In-Stock

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560

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Kepictronics

USA . 455 parts In-Stock

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455

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Overview

Unleash the power of advanced technology with the NGTB10N60R2DT4G by Onsemi. As a leader in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are designed for efficiency and reliability. This N-CHANNEL transistor comes in a sleek RECTANGULAR package with GULL WING terminals, making it easy to integrate into your applications. With a maximum VCEsat of 2.3V and a built-in diode, this transistor offers exceptional performance and durability. Whether you're in the automotive, industrial, or consumer electronics sector, the NGTB10N60R2DT4G provides the value, benefits, and advantages you need to take your projects to the next level. Trust Onsemi to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the package, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL design allows for improved performance and efficiency in power electronic systems.

Maximum VCEsat: 2.3 V

Low VCEsat value indicates efficient power conversion and reduced energy loss in the transistor.

Nominal Turn Off Time (toff): 220 ns

Fast turn-off time ensures minimal switching losses and enhances overall efficiency of the transistor.

Maximum Power Dissipation (Abs): 72 W

High power dissipation capability allows the transistor to handle heavy loads without overheating.

Maximum Collector-Emitter Voltage: 600 V

High maximum voltage rating enables the transistor to be used in a wide range of high voltage applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A low threshold voltage ensures that the transistor can be easily turned on and off with minimal power input.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB10N60R2DT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

GENERAL PURPOSE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

220 ns

Nominal Turn On Time (ton):

188 ns

Maximum VCEsat:

2.3 V

Trade Compliance

NGTB10N60R2DT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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